Thin-film devices and fabrication

ABSTRACT

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

This application claims priority to U.S. Provisional Patent ApplicationNo. 61/923,171, titled “THIN-FILM DEVICES AND FABRICATION,” filed onJan. 2, 2014 and is a continuation-in-part application of U.S. patentapplication Ser. No. 14/362,863, titled “THIN-FILM DEVICES ANDFABRICATION,” filed on Jun. 4, 2014, which claims priority toPCT/US12/68817, titled “THIN-FILM DEVICES AND FABRICATION,” filed onDec. 10, 2012, which claims priority to U.S. Provisional PatentApplication No. 61/569,716, titled “THIN-FILM DEVICES AND FABRICATION,”filed on Dec. 12, 2011, U.S. Provisional Patent Application No.61/664,638, titled “THIN-FILM DEVICES AND FABRICATION,” filed on Jun.26, 2012, and U.S. Provisional Patent Application No. 61/709,046, titled“THIN-FILM DEVICES AND FABRICATION,” filed on Oct. 2, 2012. All of theserelated applications are hereby incorporated by reference in theirentirety and for all purposes.

FIELD

Embodiments disclosed herein relate generally to optical devices, andmore particularly to methods of fabricating optical devices.

BACKGROUND

Electrochromism is a phenomenon in which a material exhibits areversible electrochemically-mediated change in an optical property whenplaced in a different electronic state, typically by being subjected toa voltage change. The optical property is typically one or more ofcolor, transmittance, absorbance, and reflectance. For example, one wellknown electrochromic material is tungsten oxide (WO₃). Tungsten oxide isa cathodically coloring electrochromic material in which a colorationtransition, bleached (non-colored) to blue, occurs by electrochemicalreduction. When electrochemical oxidation takes place, tungsten oxidetransitions from blue to a bleached state.

Electrochromic materials may be incorporated into, for example, windowsfor home, commercial and other uses. The color, transmittance,absorbance, and/or reflectance of such windows may be changed byinducing a change in the electrochromic material, that is,electrochromic windows are windows that can be darkened and lightenedreversibly via application of an electric charge. A small voltageapplied to an electrochromic device of the window will cause it todarken; reversing the voltage causes it to lighten. This capabilityallows control of the amount of light that passes through the windows,and presents an opportunity for electrochromic windows to be used asenergy-saving devices.

While electrochromism was discovered in the 1960's, electrochromicdevices, and particularly electrochromic windows, still unfortunatelysuffer various problems and have not begun to realize their fullcommercial potential despite many recent advancements in electrochromictechnology, apparatus, and related methods of making and/or usingelectrochromic devices.

SUMMARY

Thin-film devices, for example, electrochromic devices for windows, andmethods of manufacturing are described. Particular focus is given tomethods of patterning and fabricating optical devices. Various edgedeletion and isolation scribes are performed, for example, to ensure theoptical device has appropriate isolation from any edge defects, but alsoto address unwanted coloration and charge buildup in areas of thedevice. Edge treatments are applied to one or more layers of opticaldevices during fabrication. Methods described herein apply to anythin-film device having one or more material layers sandwiched betweentwo thin-film electrical conductor layers. The described methods createnovel optical device configurations.

One embodiment is an optical device including: (i) a first conductorlayer on a substrate, the first conductor layer including an area lessthan that of the substrate, the first conductor layer surrounded by aperimeter area of the substrate which is substantially free of the firstconductor layer; (ii) one or more material layers including at least oneoptically switchable material, the one or more material layersconfigured to be within the perimeter area of the substrate andco-extensive with the first conductor layer but for at least one exposedarea of the first conductor layer, the at least one exposed area of thefirst conductor layer free of the one or more material layers; and (iii)a second conductor layer on the one or more material layers, the secondconductor layer transparent and co-extensive with the one or morematerial layers, where the one or more material layers and the secondconductor layer overhang the first conductor layer but for the at leastone exposed area of the first conductor layer. The optical device mayfurther include a vapor barrier layer coextensive with the secondconductor layer. The optical device may include a diffusion barrierbetween the first conductor layer and the substrate. In certainembodiments, the optical device is fabricated on low-sodium glass, e.g.,commercially available low sodium annealed thin glass. In someembodiments, the optical device does not include an isolation scribe,i.e., there are no inactive portions of the device isolated by a scribe.

In certain embodiments, the at least one optically switchable materialis an electrochromic material. The first and second conductor layers mayboth be transparent, but at least one is transparent. In certainembodiments, the optical device is all solid-state and inorganic. Thesubstrate may be float glass, tempered or not.

Certain embodiments include an insulated glass unit (IGU) which includesoptical devices described herein. In certain embodiments, any exposedareas of the first conducting layer are configured to be within theprimary seal of the IGU. In certain embodiments, any bus bars are alsoconfigured to be within the primary seal of the IGU. In certainembodiments, any isolation or other scribes are also within the primaryseal of the IGU. Optical devices described herein may be of any shape,e.g., regular polygon shaped such as rectangular, round or oval,triangular, trapezoidal, etc., or irregularly-shaped.

Some embodiments are methods of making optical devices as describedherein. One embodiment is a method of fabricating an optical deviceincluding one or more material layers sandwiched between a first and asecond conducting layer, the method including: (i) receiving a substrateincluding the first conducting layer over its work surface (e.g., anunderlying glass layer with or without a diffusion barrier); (ii)removing a first width of the first conducting layer from between about10% and about 90% of the perimeter of the substrate; (iii) depositingthe one or more material layers of the optical device and the secondconducting layer such that they cover the first conducting layer and,where possible (except where the portion the substrate where the firstconducting layer was not removed), extend beyond the first conductinglayer about its perimeter; (iv) removing a second width, narrower thanthe first width, of all the layers about substantially the entireperimeter of the substrate, where the depth of removal is at leastsufficient to remove the first conducting layer; (v) removing at leastone portion of the second transparent conducting layer and the one ormore layers of the optical device thereunder thereby revealing at leastone exposed portion of the first conducting layer; and (vi) applying anelectrical connection, e.g. a bus bar, to the at least one exposedportion of the first transparent conducting layer; where at least one ofthe first and second conducting layers is transparent.

In one embodiment, (ii) includes removing the first width of the firstconducting layer from between about 50% and about 75% around theperimeter of the substrate. In one embodiment, the at least one exposedportion of the first conducting layer exposed is fabricated along theperimeter portion of the optical device proximate the side or sides ofthe substrate where the first conducting layer was not removed in (ii).Methods may further include applying at least one additional electricalconnection (e.g., a second bus bar) to the second conducting layer.Aspects of methods described herein may be performed in an all vacuumintegrated deposition apparatus. Methods may further include fabricatingan IGU using optical devices as described herein.

Certain embodiments include fabrication methods, and resulting devices,having particular edge treatments which create more robust and betterperforming devices. For example the edge of an electrochromic devicelayer or layers may be tapered in order to avoid stress and cracking inoverlying layers of the device construct. In another example, lowerconductor exposure for bus bar application is carried out to ensure goodelectrical contact and uniform coloration front in the electrochromicdevice. In certain embodiments, device edge treatments, isolationscribes and lower conductor layer exposures are performed using variabledepth laser scribes.

These and other features and advantages will be described in furtherdetail below, with reference to the associated drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed description can be more fully understood whenconsidered in conjunction with the drawings in which:

FIGS. 1A, 1B, and 1C are cross-section, end view, and top view drawingsrespectively of an electrochromic device fabricated on a glasssubstrate.

FIG. 1D is a detailed portion of the cross-section shown in FIG. 1A.

FIG. 2A is a partial cross-section of an improved electrochromic devicearchitecture on a substrate, according to disclosed embodiments.

FIGS. 2B-2C—are cross-sectional and end view drawings respectively of animproved device architecture similar to that described in relation toFIG. 2A.

FIGS. 2D-2E are partial cross-sectional and top view drawingsrespectively of a device with an architecture similar to that describedin relation to FIGS. 2A-C.

FIG. 3 is a partial cross-section showing an improved devicearchitecture where the diffusion barrier is removed along with the lowerconducting layer.

FIG. 4A is a flowchart of a process flow describing aspects of a methodof fabricating an electrochromic device, according to embodiments.

FIG. 4B are top views depicting steps in the process flow described inrelation to FIG. 4A.

FIG. 4C depicts cross-sections of the electrochromic lite described inrelation to FIG. 4B.

FIG. 4D is a top view schematic depicting steps during fabrication on around substrate.

FIG. 4E is a top view schematic depicting steps during fabrication of anelectrochromic device.

FIG. 4F is a schematic drawing in the perspective view depictingfabrication of an IGU with an optical device.

FIG. 4G is a schematic drawing of top views of devices similar to thatdescribed in relation to FIG. 4B.

FIGS. 4H and 4I are schematic drawings depicting steps of a process flowsimilar to that described in relation to FIG. 4A and carried out on alarge-area substrate as applied to coat then cut methods.

FIG. 4J is a drawing depicting roll-to-roll processing forming laminatesof electrochromic devices where the lamination uses a flexible matelite.

FIG. 4K is a flowchart of a process flow describing aspects of a methodof fabricating an optical device where a laminate substrate isfabricated first, followed by fabrication of the optical device thereon.

FIG. 4L depicts a top view of a lamination apparatus.

FIGS. 4M and 4N depicts processing of laminates and laminates formedthereby, respectively.

FIGS. 4O and 4P are cross sections showing various edge types andtreatments as described herein.

FIG. 4Q depicts an IGU fabrication assembly line.

FIG. 4R depicts a process flow.

FIG. 5A is a flowchart of a process flow describing aspects of a methodof fabricating an optical device having opposing bus bars on each offirst and second conductor layers.

FIG. 5B is a schematic of top-views depicting steps in the process flowdescribed in relation to FIG. 5A.

FIG. 5C shows cross-sections of the electrochromic lite described inrelation to FIG. 5B.

FIGS. 5D and 5E are top view schematics of electrochromic devices.

FIGS. 5F and 5G are schematic drawings depicting steps in a process flowsimilar to that described in relation to FIG. 5A and carried out on alarge-area substrate as applied to coat then cut methods, according toembodiments.

FIG. 6A is a schematic drawing depicting roll-to-roll fabrication ofelectrochromic devices on flexible substrates and optional laminationwith rigid substrates.

FIG. 6B is a schematic drawing depicting lamination of electrochromicdevices on flexible glass substrates and lamination with flexiblesubstrates.

FIG. 7 includes cross-sectional views of an electrochromic devicesimilar to the device described in relation to FIG. 4C, detailingproblematic issues overcome by certain embodiments described herein.

FIGS. 8A and 8B is a cross-sectional and top view respectively of anelectrochromic device describing tapering the edge(s) of the lowerconductor layer in order to avoid stress in subsequently depositedoverlying layers.

FIGS. 9A and 9B are drawings depicting problematic issues related toexposure of a lower conductor for bus bar application.

FIGS. 10A through 10F are drawings depicting embodiments for improvedbus bar pad exposure.

DETAILED DESCRIPTION

For the purposes of brevity, embodiments are described in terms ofelectrochromic devices; however, the scope of the disclosure is not solimited. One of ordinary skill in the art would appreciate that methodsdescribed can be used to fabricate virtually any thin-film device whereone or more layers are sandwiched between two thin-film conductorlayers. Certain embodiments are directed to optical devices, that is,thin-film devices having at least one transparent conductor layer. Inthe simplest form, an optical device includes a substrate and one ormore material layers sandwiched between two conductor layers, one ofwhich is transparent. In one embodiment, an optical device includes atransparent substrate and two transparent conductor layers. In anotherembodiment, an optical device includes a transparent substrate uponwhich is deposited a transparent conductor layer (the lower conductorlayer) and the other (upper) conductor layer is not transparent. Inanother embodiment, the substrate is not transparent, and one or both ofthe conductor layers is transparent. Some examples of optical devicesinclude electrochromic devices, flat panel displays, photovoltaicdevices, suspended particle devices (SPD's), liquid crystal devices(LCD's), and the like. For context, a description of electrochromicdevices is presented below. For convenience, all solid-state andinorganic electrochromic devices are described; however, embodiments arenot limited in this way.

A particular example of an electrochromic lite is described withreference to FIGS. 1A-1D, in order to illustrate embodiments describedherein. The electrochromic lite includes an electrochromic devicefabricated on a substrate. FIG. 1A is a cross-sectional representation(see cut X-X′ of FIG. 1C) of an electrochromic lite, 100, which isfabricated starting with a glass sheet, 105. FIG. 1B shows an end view(see perspective Y-Y′ of FIG. 1C) of electrochromic lite 100, and FIG.1C shows a top-down view of electrochromic lite 100.

FIG. 1A shows the electrochromic lite 100 after fabrication on glasssheet 105 and the edge has been deleted to produce area 140 around theperimeter of the lite. Edge deletion refers to removing one or morematerial layers from the device about some perimeter portion of thesubstrate. Typically, though not necessarily, edge deletion removesmaterial down to and including the lower conductor layer (e.g., layer115 in the example depicted in FIGS. 1A-1D), and may include removal ofany diffusion barrier layer(s) down to the substrate itself. In FIGS.1A-1B, the electrochromic lite 100 has also been laser scribed and busbars have been attached. The glass lite, 105, has a diffusion barrier,110, and a first transparent conducting oxide (TCO) 115 on the diffusionbarrier.

In this example, the edge deletion process removes both TCO 115 anddiffusion barrier 110, but in other embodiments, only the TCO isremoved, leaving the diffusion barrier intact. The TCO layer 115 is thefirst of two conductive layers used to form the electrodes of theelectrochromic device fabricated on the glass sheet. In some examples,the glass sheet may be prefabricated with the diffusion barrier formedover underlying glass. Thus, the diffusion barrier is formed, and thenthe first TCO 115, an EC stack 125 (e.g., stack having electrochromic,ion conductor, and counter electrode layers), and a second TCO, 130, areformed. In other examples, the glass sheet may be prefabricated withboth the diffusion barrier and the first TCO 115 formed over underlyingglass.

In certain embodiments, one or more layers may be formed on a substrate(e.g., glass sheet) in an integrated deposition system where thesubstrate does not leave the integrated deposition system at any timeduring fabrication of the layer(s). In one embodiment, an electrochromicdevice including an EC stack and a second TCO may be fabricated in theintegrated deposition system where the glass sheet does not leave theintegrated deposition system at any time during fabrication of thelayers. In one case, the first TCO layer may also be formed using theintegrated deposition system where the glass sheet does not leave theintegrated deposition system during deposition of the EC stack, and theTCO layer(s). In one embodiment, all of the layers (e.g., diffusionbarrier, first TCO, EC stack, and second TCO) are deposited in theintegrated deposition system where the glass sheet does not leave theintegrated deposition system during deposition. In this example, priorto deposition of EC stack 125, an isolation trench, 120, may be cutthrough first TCO 115 and diffusion barrier 110. Trench 120 is made incontemplation of electrically isolating an area of first TCO 115 thatwill reside under bus bar 1 after fabrication is complete (see FIG. 1A).Trench 120 is sometimes referred to as the “L1” scribe, because it isthe first laser scribe in certain processes. This is done to avoidcharge buildup and coloration of the EC device under the bus bar, whichcan be undesirable. This undesirable result is explained in more detailbelow and was the impetus for certain embodiments described herein. Thatis, certain embodiments are directed toward eliminating the need forisolation trenches, such as trench 120, for example, to avoid chargebuildup under a bus bar, but also to simplify fabrication of the deviceby reducing or even eliminating laser isolation scribe steps.

After formation of the EC device, edge deletion processes and additionallaser scribing are performed. FIGS. 1A and 1B depict areas 140 where theEC device has been removed, in this example, from a perimeter regionsurrounding laser scribe trenches, 150, 155, 160 and 165. Laser scribes150, 160 and 165 are sometimes referred to as “L2” scribes, because theyare the second scribes in certain processes. Laser scribe 155 issometimes referred to as the “L3” scribe, because it is the third scribein certain processes. The L3 scribe passes through second TCO, 130, andin this example (but not necessarily) the EC stack 125, but not thefirst TCO 115. Laser scribe trenches 150, 155, 160, and 165 are made toisolate portions of the EC device, 135, 145, 170, and 175, which werepotentially damaged during edge deletion processes from the operable ECdevice. In one embodiment, laser scribe trenches 150, 160, and 165 passthrough the first TCO to aid in isolation of the device (laser scribetrench 155 does not pass through the first TCO, otherwise it would cutoff bus bar 2's electrical communication with the first TCO and thus theEC stack). In some embodiments, such as those depicted in FIGS. 1A-1D,laser scribe trenches 150, 160, and 165 may also pass through adiffusion barrier.

The laser or lasers used for the laser scribe processes are typically,but not necessarily, pulse-type lasers, for example, diode-pumped solidstate lasers. For example, the laser scribe processes can be performedusing a suitable laser. Some examples of suppliers that may providesuitable lasers include IPG Photonics Corp. (of Oxford, Mass.), Ekspla(of Vilnius, Lithuania), TRUMPF Inc. (Farmington, Conn.), SPI Lasers LLC(Santa Clara, Calif.), Spectra-Physics Corp. (Santa Clara, Calif.),nLIGHT Inc. (Vancouver, Wash.), and Fianium Inc. (Eugene, Oreg.).Certain scribing steps can also be performed mechanically, for example,by a diamond tipped scribe; however, certain embodiments describe depthcontrol during scribes or other material removal processing, which iswell controlled with lasers. For example, in one embodiment, edgedeletion is performed to the depth of the first TCO, in anotherembodiment edge deletion is performed to the depth of a diffusionbarrier (the first TCO is removed), in yet another embodiment edgedeletion is performed to the depth of the substrate (all material layersremoved down to the substrate). In certain embodiments, variable depthscribes are described.

After laser scribing is complete, bus bars are attached. Non-penetratingbus bar (1) is applied to the second TCO. Non-penetrating bus bar (2) isapplied to an area where the device including an EC stack and a secondTCO was not deposited (for example, from a mask protecting the first TCOfrom device deposition) or, in this example, where an edge deletionprocess (e.g. laser ablation using an apparatus e.g. having a XY or XYZgalvanometer) was used to remove material down to the first TCO. In thisexample, both bus bar 1 and bus bar 2 are non-penetrating bus bars. Apenetrating bus bar is one that is typically pressed into (or soldered)and through one or more layers to make contact with a lower conductor,e.g. TCO located at the bottom of or below one or more layers of the ECstack). A non-penetrating bus bar is one that does not penetrate intothe layers, but rather makes electrical and physical contact on thesurface of a conductive layer, for example, a TCO. A typical example ofa non-penetrating bus bar is a conductive ink, e.g. a silver-based ink,applied to the appropriate conductive surface.

The TCO layers can be electrically connected using a non-traditional busbar, for example, a bus bar fabricated with screen and lithographypatterning methods. In one embodiment, electrical communication isestablished with the device's transparent conducting layers via silkscreening (or using another patterning method) a conductive ink followedby heat curing or sintering the ink. Advantages to using the abovedescribed device configuration include simpler manufacturing, forexample, and less laser scribing than conventional techniques which usepenetrating bus bars.

After the bus bars are fabricated or otherwise applied to one or moreconductive layers, the electrochromic lite may be integrated into aninsulated glass unit (IGU), which includes, for example, wiring for thebus bars and the like. In some embodiments, one or both of the bus barsare inside the finished IGU. In particular embodiments, both bus barsare configured between the spacer and the glass of the IGU (commonlyreferred to as the primary seal of the IGU); that is, the bus bars areregistered with the spacer used to separate the lites of an IGU. Area140 is used, at least in part, to make the seal with one face of thespacer used to form the IGU. Thus, the wires or other connection to thebus bars runs between the spacer and the glass. As many spacers are madeof metal, e.g., stainless steel, which is conductive, it is desirable totake steps to avoid short circuiting due to electrical communicationbetween the bus bar and connector thereto and the metal spacer.Particular methods and apparatus for achieving this end are described inU.S. patent application Ser. No. 13/312,057, filed Dec. 6, 2011, andtitled “Improved Spacers for Insulated Glass Units,” which is herebyincorporated by reference in its entirety. In certain embodimentsdescribed herein, methods and resulting IGUs include having theperimeter edge of the EC device, bus bars and any isolation scribes areall within the primary seal of the IGU.

FIG. 1D depicts a portion of the cross section in FIG. 1A, where aportion of the depiction is expanded to illustrate an issue for whichcertain embodiments disclosed herein may overcome. Prior to fabricationof EC stack 125 on TCO 115, an isolation trench, 120, is formed throughTCO 115 and diffusion barrier 110 in order to isolate a portion of the115/110 stack from a larger region. This isolation trench is intended tocut off electrical communication of the lower TCO 115, which isultimately in electrical communication with bus bar 2, with a section ofTCO 115 that lies directly below bus bar 1, which lies on TCO 130 andsupplies electrical energy thereto. For example, during coloration ofthe EC device, bus bar 1 and bus bar 2 are energized in order to apply apotential across the EC device; for example, TCO 115 has a negativecharge and TCO 130 has a positive charge or visa versa.

Isolation trench 120 is desirable for a number of reasons. It issometimes desirable not to have the EC device color under bus bar 1since this area is not viewable to the end user (the window frametypically extends beyond the bus bars and the isolation trench and/orthese features are under the spacer as described above). Also, sometimesarea 140 includes the lower TCO and the diffusion barrier, and in theseinstances it is undesirable for the lower TCO to carry charge to theedge of the glass, as there may be shorting issues and unwanted chargeloss in areas that are not seen by the end user. Also, because theportion of the EC device directly under the bus bar experiences the mostcharge flux, there is a predisposition for this region of the device toform defects, e.g., delamination, particle dislodging (pop-off defects),and the like, which can cause abnormal or no coloring regions thatbecome visible in the viewable region and/or negatively affect deviceperformance. Isolation trench 120 was designed to address these issues.Despite these desired outcomes, it has been found that coloration belowthe first bus bar still occurs. This phenomenon is explained in relationto the expanded section of device 100 in the lower portion of FIG. 1D.

When EC stack 125 is deposited on first TCO 115, the electrochromicmaterials, of which EC stack 125 is comprised, fill isolation trench120. Though the electrical path of first TCO 115 is cut off by trench120, the trench becomes filled with material that, although not aselectrically conductive as the TCO, is able to carry charge and ispermeable to ions. During operation of EC lite 100, e.g. when first TCO115 has a negative charge (as depicted in FIG. 1D), small amounts ofcharge pass across trench 120 and enter the isolated portion of firstTCO 115. This charge buildup may occur over several cycles of coloringand bleaching EC lite 100. Once the isolated area of TCO 115 has chargebuilt up, it allows coloration of the EC stack 125 under bus bar 1, inarea 180. Also, the charge in this portion of first TCO 115, once builtup, does not drain as efficiently as charge normally would in theremaining portion of TCO 115, e.g., when an opposite charge is appliedto bus bar 2. Another problem with isolation trench 120 is that thediffusion barrier may be compromised at the base of the trench. This canallow sodium ions to diffuse into the EC stack 125 from the glasssubstrate. These sodium ions can act as charge carriers and enhancecharge buildup on the isolated portion of first TCO 115. Yet anotherissue is that charge buildup under the bus bar can impose excess stresson the material layers and promote defect formation in this area.Finally, fabricating an isolation scribe in the conductor layer on thesubstrate adds further complication to the processing steps. Embodimentsdescribed herein may overcome these problems and others.

FIG. 2A is a partial cross-section showing an improved architecture ofan EC device, 200. In this illustrated embodiment, the portion of firstTCO 115 that would have extended below bus bar 1 is removed prior tofabrication of EC stack 125. In this embodiment, diffusion barrier 110extends to under bus bar 1 and to the edge of the EC device. In someembodiments, the diffusion barrier extends to the edge of glass 105,that is, it covers area 140. In other embodiments, a portion of thediffusion barrier may also be removed under the bus bar 1. In theaforementioned embodiments, the selective TCO removal under bus bar 1 isperformed prior to fabrication of EC stack 125. Edge deletion processesto form areas 140 (e.g., around the perimeter of the glass where thespacer forms a seal with the glass) can be performed prior to devicefabrication or after. In certain embodiments, an isolation scribetrench, 150 a, is formed if the edge delete process to form 140 createsa rough edge or otherwise unacceptable edge due to, e.g., shortingissues, thus isolating a portion, 135 a, of material from the remainderof the EC device. As exemplified in the expanded portion of EC device200 depicted in FIG. 2A, since there is no portion of TCO 115 under busbar 1, the aforementioned problems such as unwanted coloring and chargebuildup may be avoided. Also, since diffusion barrier 110 is leftintact, at least co-extensive with EC stack 125, sodium ions areprevented from diffusing into the EC stack 125 and causing unwantedconduction or other problems.

In certain embodiments, a band of TCO 115 is selectively removed in theregion under where bus bar 1 will reside once fabrication is complete.That is, the diffusion barrier 110 and first TCO 115 may remain on thearea 140, but a width of the first TCO 115 is selectively removed underbus bar 1. In one embodiment, the width of the removed band of TCO 115may greater than the width of the bus bar 1 which resides above theremoved band of TCO once device fabrication is complete. Embodimentsdescribed herein include an EC device having the configuration asdepicted and described in relation to FIG. 2A with a selectively removedband of TCO 115. In one embodiment, the remainder of the device is asdepicted and described as in relation to FIGS. 1A-C.

A device similar to device 200 is depicted in FIGS. 2B and 2C, showingthe device architecture including laser isolation trenches and the like.FIGS. 2B and 2C are drawings of an improved device architecture ofdisclosed embodiments. In certain embodiments, there are fewer, or no,laser isolation trenches made during fabrication of the device. Theseembodiments are described in more detail below.

FIGS. 2D and 2E depict an electrochromic device, 205, which hasarchitecture very similar to device 200, but it has neither a laserisolation scribe 150 a, nor an isolated region, 135 a, of the devicethat is non-functional. Certain laser edge delete processes leave asufficiently clean edge of the device such that laser scribes like 150 aare not necessary. One embodiment is an optical device as depicted inFIGS. 2D and 2E but not having isolation scribes 160 and 165, norisolated portions 170 and 175. One embodiment is an optical device asdepicted in FIGS. 2D and 2E but not having isolation scribe 155, norisolated portion 145. One embodiment is an optical device as depicted inFIGS. 2D and 2E but not having isolation scribes 160, 165, or 155, norisolated portions 145, 170, and 175. In certain embodiments, fabricationmethods do not include any laser isolation scribes and thus produceoptical devices having no physically isolated non-functional portions ofthe device.

As described in more detail below, certain embodiments include deviceswhere the one or more material layers of the device and the second(upper) conductor layer are not co-extensive with the first (lower)conductor layer; specifically, these portions overhang the firstconductor layer about some portion of the perimeter of the area of thefirst conductor. These overhanging portions may or may not include a busbar. As an example, the overhanging portions as described in relation toFIG. 2A or 3 do have a bus bar on the second conductor layer.

FIG. 3 is a partial cross-section showing an improved electrochromicdevice architecture, 300 of disclosed embodiments. In this illustratedembodiment, the portions of TCO 115 and diffusion barrier 110 that wouldhave extended below bus bar 1 are removed prior to fabrication of ECstack 125. That is, the first TCO and diffusion barrier removal underbus bar 1 is performed prior to fabrication of EC stack 125. Edgedeletion processes to form areas 140 (e.g., around the perimeter of theglass where the spacer forms a seal with the glass) can be performedprior to device fabrication (e.g., removing the diffusion barrier andusing a mask thereafter) or after device fabrication (removing allmaterials down to the glass). In certain embodiments, an isolationscribe trench, analogous to 150 a in FIG. 2A, is formed if the edgedeletion process to form 140 creates a rough edge, thus isolating aportion, 135 a (see FIG. 2A), of material from the remainder of the ECdevice.

Referring again to FIG. 3, as exemplified in the expanded portion ofdevice 300, since there is no portion of TCO 115 under bus bar 1,therefore the aforementioned problems such as unwanted coloring andcharge buildup may be avoided. In this example, since diffusion barrier110 is also removed, sodium ions may diffuse into the EC stack in theregion under bus bar 1; however, since there is no corresponding portionof TCO 115 to gain and hold charge, coloring and other issues are lessproblematic. In certain embodiments, a band of TCO 115 and diffusionbarrier 110 is selectively removed in the region under where bus bar 1will reside; that is, on the area 140, the diffusion barrier and TCO mayremain, but a width of TCO 115 and diffusion barrier 110 is selectivelyremoved under and at least co-extensive with bus bar 1. In oneembodiment, the width of the removed band of TCO and diffusion barrieris greater than the width of the bus bar which resides above the removedband once device fabrication is complete. Embodiments described hereininclude an EC device having the configuration as depicted and describedin relation to FIG. 3. In one embodiment, the remainder of the device isas depicted and described as in relation to FIGS. 1A-C. In certainembodiments, there are fewer, or no, laser isolation trenches madeduring fabrication of the device.

Embodiments include an optical device as described in relation to FIG.3, where the remainder is as device 205 as described in relation toFIGS. 2D and 2E. One embodiment is an optical device as depicted in FIG.3, but not having isolation scribes 160 and 165, nor isolated portions170 and 175, as depicted FIGS. 2D and 2E. One embodiment is an opticaldevice as depicted in FIG. 3, but not having isolation scribe 155, norisolated portion 145, as depicted in FIGS. 2D and 2E. One embodiment isan optical device as depicted in FIG. 3, but not having isolationscribes 160, 165, or 155, nor isolated portions 145, 170, and 175, asdepicted in FIGS. 2D and 2E. Any of the aforementioned embodiments mayalso include an isolation scribe analogous to scribe 150 as depicted inrelation to FIGS. 1A-D, but not an isolation scribe analogous to scribe120. All embodiments described herein obviate the need for a laserisolation scribe analogous to scribe 120, as described in relation toFIGS. 1A-D. In addition, the goal is to reduce the number of laserisolation scribes needed, but depending upon the device materials orlasers used for example, the scribes other than scribe 120 may or maynot be necessary.

As described above, in certain embodiments, devices are fabricatedwithout the use of laser isolation scribes, that is, the final devicehas no isolated portions that are non-functional. Exemplary fabricationmethods are described below in terms of having no isolation scribes;however, it is to be understood that one embodiment is any device asdescribed below, where the device has the functional equivalent(depending on its geometry) of the isolation scribes as described inrelation to FIGS. 1A-D, but not isolation scribe 120. More specifically,one embodiment is an optical device as described below, but not havingisolation scribes 160 and 165 as depicted FIGS. 2D and 2E. Oneembodiment is an optical device as described below, but not havingisolation scribe 155 as depicted in FIGS. 2D and 2E. One embodiment isan optical device as described below, but not having isolation scribes160, 165, or 155 as depicted in FIGS. 2D and 2E. Any of theaforementioned embodiments may also include an isolation scribeanalogous to scribe 150 as depicted in relation to FIGS. 1A-D.

One embodiment is a method of fabricating an optical device includingone or more material layers sandwiched between a first conducting layer(e.g., first TCO 115) and a second conducting layer (e.g., second TCO130). The method includes: (i) receiving a substrate including the firstconducting layer over its work surface; (ii) removing a first width ofthe first conducting layer from between about 10% and about 90% of theperimeter of the substrate; (iii) depositing the one or more materiallayers of the optical device and the second conducting layer such thatthey cover the first conducting layer and, where possible, extend beyondthe first conducting layer about its perimeter; (iv) removing a secondwidth, narrower than the first width, of all the layers aboutsubstantially the entire perimeter of the substrate, where the depth ofremoval is at least sufficient to remove the first conducting layer; (v)removing at least one portion of the second transparent conducting layerand the one or more layers of the optical device thereunder therebyrevealing at least one exposed portion of the first conducting layer;and (vi) applying a bus bar to the at least one exposed portion of thefirst transparent conducting layer; where at least one of the first andsecond conducting layers is transparent. In one embodiment, (ii)includes removing the first width of the first conducting layer frombetween about 50% and about 75% around the perimeter of the substrate.

In one embodiment, a portion of the edge of the first conducting layerremaining after (ii) is tapered as described in more detail below. Thetapered portion of the edge may include one, two or more sides if thetransparent conductor is of a polygonal shape after (ii). In some cases,the first conducting layer is polished before (ii), and then optionallyedge tapered. In other cases, the first conducting layer is polishedafter (ii), with or without edge tapering. In the latter cases, taperingcan be prior to polish or after polishing.

In one embodiment, the at least one exposed portion of the firstconducting layer exposed is fabricated along the perimeter portion ofthe optical device proximate the side or sides of the substrate wherethe first conducting layer was not removed in (ii). In certainembodiments, the exposed portion of the first conducting layer is not anaperture, or hole, through the one or more material layers and secondconducting layer, but rather the exposed portion is an area that sticksout from an edge portion of the functional device stack layers. This isexplained in more detail below with reference to particular examples.

The method may further include applying at least one second bus bar tothe second conducting layer, particularly on a portion that does notcover the first conducting layer. In one embodiment, the optical deviceis an electrochromic device and may be all solid-state and inorganic.The substrate may be float glass and the first conducting layer mayinclude tin oxide, e.g. fluorinated tin oxide. In one embodiment, (iii)is performed in an all vacuum integrated deposition apparatus. Incertain embodiments, the method further includes depositing a vaporbarrier layer on the second conducting layer prior to (iv).

In one embodiment, the at least one exposed portion of the firstconducting layer is fabricated along the length of one side of theoptical device, in one embodiment along the length of the side of theoptical device proximate the side of the substrate where the firstconducting layer was not removed in (ii). In one embodiment, the atleast one second bus bar is applied to the second conducting layerproximate the side of the optical device opposite the at least oneexposed portion of the first conducting layer. If a vapor barrier isapplied a portion is removed in order to expose the second conductorlayer for application of the at least one second bus bar. These methodsare described below in relation to specific embodiments with relation toFIGS. 4A-D.

FIG. 4A is a process flow, 400, describing aspects of a method offabricating an electrochromic device or other optical device havingopposing bus bars, each applied to one of the conductor layers of theoptical device. The dotted lines denote optional steps in the processflow. An exemplary device, 440, as described in relation to FIGS. 4B-C,is used to illustrate the process flow. FIG. 4B provides top viewsdepicting the fabrication of device 440 including numerical indicatorsof process flow 400 as described in relation to FIG. 4A. FIG. 4C showscross-sections of the lite including device 440 described in relation toFIG. 4B. Device 440 is a rectangular device, but process flow 400applies to any shape of optical device having opposing bus bars, each onone of the conductor layers. This aspect is described in more detailbelow, e.g. in relation to FIG. 4D (which illustrates process flow 400as it relates to fabrication of a round electrochromic device).

Referring to FIGS. 4A and 4B, after receiving a substrate with a firstconductor layer thereon, process flow 400 begins with an optionalpolishing of the first conductor layer, see 401. In certain embodiments,polishing a lower transparent conductor layer has been found to enhancethe optical properties of, and performance of, EC devices fabricatedthereon. Polishing of transparent conducting layers prior toelectrochromic device fabrication thereon is described in patentapplication, PCT/US12/57606, titled, “Optical Device Fabrication,” filedon Sep. 27, 2012, which is hereby incorporated by reference in itsentirety. Polishing, if performed, may be done prior to an edgedeletion, see 405, or after an edge deletion in the process flow. Incertain embodiments, the lower conductor layer may be polished bothbefore and after edge deletion. Typically, the lower conductor layer ispolished only once.

Referring again to FIG. 4A, if polishing 401 is not performed, process400 begins with edge deleting a first width about a portion of theperimeter of the substrate, see 405. The edge deletion may remove onlythe first conductor layer or may also remove a diffusion barrier, ifpresent. In one embodiment, the substrate is glass and includes a sodiumdiffusion barrier and a transparent conducting layer thereon, e.g. atin-oxide based transparent metal oxide conducting layer. The substratemay be rectangular (e.g., the square substrate depicted in see FIG. 4B).The dotted area in FIG. 4B denotes the first conductor layer. Thus,after edge deletion according to process 405, a width A is removed fromthree sides of the perimeter of substrate 430. This width is typically,but not necessarily, a uniform width. A second width, B, is describedbelow. Where width A and/or width B are not uniform, then their relativemagnitudes with respect to each other are in terms of their averagewidth.

As a result of the removal of the first width A at 405, there is a newlyexposed edge of the lower conductor layer. In certain embodiments, atleast a portion of this edge of the first conductive layer may beoptionally tapered, see 407 and 409. The underlying diffusion barrierlayer may also be tapered. The inventors have found that tapering theedge of one or more device layers, prior to fabricating subsequentlayers thereon, has unexpected advantages in device structure andperformance. The edge tapering process is described in more detail inrelation to FIGS. 8A and 8B.

In certain embodiments, the lower conductor layer is optionally polishedafter edge tapering, see 408. It has been found, that with certaindevice materials, it may be advantageous to polish the lower conductorlayer after the edge taper, as polishing can have unexpected beneficialeffects on the edge taper as well as the bulk conductor surface whichmay improve device performance (as described above). In certainembodiments, the edge taper is performed after polish 408, see 409.Although edge tapering is shown at both 407 and 409 in FIG. 4A, ifperformed, edge tapering would typically be performed once (e.g., at 407or 409).

After removal of the first width A, and optional polishing and/oroptional edge tapering as described above, the EC device is depositedover the surface of substrate 430, see 410. This deposition includes oneor more material layers of the optical device and the second conductinglayer, e.g. a transparent conducting layer such as indium tin oxide(ITO). The depicted coverage is the entire substrate, but there could besome masking due to a carrier that must hold the glass in place. In oneembodiment, the entire area of the remaining portion of the firstconductor layer is covered including overlapping the first conductorabout the first width A previously removed. This allows for overlappingregions in the final device architecture as explained in more detailbelow.

In particular embodiments, electromagnetic radiation is used to performedge deletion and provide a peripheral region of the substrate, e.g. toremove transparent conductor layer or more layers (up to and includingthe top conductor layer and any vapor barrier applied thereto),depending upon the process step. In one embodiment, the edge deletion isperformed at least to remove material including the transparentconductor layer on the substrate, and optionally also removing adiffusion barrier if present. In certain embodiments, edge deletion isused to remove a surface portion of the substrate, e.g. float glass, andmay go to a depth not to exceed the thickness of the compression zone.Edge deletion is performed, e.g., to create a good surface for sealingby at least a portion of the primary seal and the secondary seal of theIGU. For example, a transparent conductor layer can sometimes loseadhesion when the conductor layer spans the entire area of the substrateand thus has an exposed edge, despite the presence of a secondary seal.Also, it is believed that when metal oxide and other functional layershave such exposed edges, they can serve as a pathway for moisture toenter the bulk device and thus compromise the primary and secondaryseals.

Edge deletion is described herein as being performed on a substrate thatis already cut to size. However, edge deletion can be done before asubstrate is cut from a bulk glass sheet in other disclosed embodiments.For example, non-tempered float glass may be cut into individual litesafter an EC device is patterned thereon. Methods described herein can beperformed on a bulk sheet and then the sheet cut into individual EClites. In certain embodiments, edge deletion may be carried out in someedge areas prior to cutting the EC lites, and again after they are cutfrom the bulk sheet. In certain embodiments, all edge deletion isperformed prior to excising the lites from the bulk sheet. Inembodiments employing “edge deletion” prior to cutting the panes,portions of the coating on the glass sheet can be removed inanticipation of where the cuts (and thus edges) of the newly formed EClites will be. In other words, there is no actual substrate edge yet,only a defined area where a cut will be made to produce an edge. Thus“edge deletion” is meant to include removing one or more material layersin areas where a substrate edge is anticipated to exist. Methods offabricating EC lites by cutting from a bulk sheet after fabrication ofthe EC device thereon are described in U.S. patent application Ser. No.12/941,882 (now U.S. Pat. No. 8,164,818), filed Nov. 8, 2010, and U.S.patent application Ser. No. 13/456,056, filed Apr. 25, 2012, each titled“Electrochromic Window Fabrication Methods” each of which is herebyincorporated by reference in its entirety. One of ordinary skill in theart would appreciate that if one were to carry out methods describedherein on a bulk glass sheet and then cut individual lites therefrom, incertain embodiments masks may have to be used, whereas when performed ona lite of desired end size, masks are optional.

Exemplary electromagnetic radiation includes UV, lasers, and the like.For example, material may be removed with directed and focused energyone of the wavelengths 248 nm, 355 nm (UV), 1030 nm (IR, e.g. disklaser), 1064 nm (e.g. Nd:YAG laser), and 532 nm (e.g. green laser).Laser irradiation is delivered to the substrate using, e.g. opticalfiber or open beam path. The ablation can be performed from either thesubstrate side or the EC film side depending on the choice of thesubstrate handling equipment and configuration parameters. The energydensity required to ablate the film thickness is achieved by passing thelaser beam through an optical lens. The lens focuses the laser beam tothe desired shape and size. In one embodiment, a “top hat” beamconfiguration is used, e.g., having a focus area of between about 0.005mm² to about 2 mm². In one embodiment, the focusing level of the beam isused to achieve the required energy density to ablate the EC film stack.In one embodiment, the energy density used in the ablation is betweenabout 2 J/cm² and about 6 J/cm².

During a laser edge delete process, a laser spot is scanned over thesurface of the EC device, along the periphery. In one embodiment, thelaser spot is scanned using a scanning F theta lens. Homogeneous removalof the EC film is achieved, e.g., by overlapping the spots' area duringscanning. In one embodiment, the overlap is between about 5% and about100%, in another embodiment between about 10% and about 90%, in yetanother embodiment between about 10% and about 80%. Various scanningpatterns may be used, e.g., scanning in straight lines, curved lines,and various patterns may be scanned, e.g., rectangular or other shapedsections are scanned which, collectively, create the peripheral edgedeletion area. In one embodiment the scanning lines (or “pens,” i.e.lines created by adjacent or overlapping laser spots, e.g. square,round, etc.) are overlapped at the levels described above for spotoverlap. That is, the area of the ablated material defined by the pathof the line previously scanned is overlapped with later scan lines sothat there is overlap. That is, a pattern area ablated by overlapping oradjacent laser spots is overlapped with the area of a subsequentablation pattern. For embodiments where overlapping is used, spots,lines or patterns, a higher frequency laser, e.g. in the range ofbetween about 11 KHz and about 500 KHz, may be used. In order tominimize heat related damage to the EC device at the exposed edge (aheat affected zone or “HAZ”), shorter pulse duration lasers are used. Inone example, the pulse duration is between about 100 fs (femtosecond)and about 100 ns (nanosecond), in another embodiment the pulse durationis between about 1 ps (picosecond) and about 50 ns, in yet anotherembodiment the pulse duration is between about 20 ps and about 30 ns.Pulse duration of other ranges can be used in other embodiments.

Referring again to FIGS. 4A and 4B, process flow 400 continues withremoving a second width, B, narrower than the first width A, aboutsubstantially the entire perimeter of the substrate, see 415. This mayinclude removing material down to the glass or to a diffusion barrier,if present. After process flow 400 is complete up to 415, e.g. on arectangular substrate as depicted in FIG. 4B, there is a perimeter area,with at least width B, where there is none of the first transparentconductor, the one or more material layers of the device, or the secondconducting layer—removing width B has exposed diffusion barrier orsubstrate. Within this perimeter area is the device stack, including thefirst transparent conductor surrounded on three sides by overlapping oneor more material layers and the second conductor layer. On the remainingside (e.g., the bottom side in FIG. 4B) there is no overlapping portionof the one or more material layers and the second conductor layer. It isproximate this remaining side (e.g., bottom side in FIG. 4B) that theone or more material layers and the second conductor layer are removedin order to expose a portion (bus bar pad expose, or “BPE”), 435, of thefirst conductor layer, see 420. The BPE 435 need not run the entirelength of that side, it need only be long enough to accommodate the busbar and leave some space between the bus bar and the second conductorlayer so as not to short on the second conductor layer. In oneembodiment, the BPE 435 spans the length of the first conductor layer onthat side.

As described above, in various embodiments, a BPE is where a portion ofthe material layers are removed down to the lower electrode or otherconductive layer (e.g. a transparent conducting oxide layer), in orderto create a surface for a bus bar to be applied and thus make electricalcontact with the electrode. The bus bar applied can be a soldered busbar, and ink bus bar and the like. A BPE typically has a rectangulararea, but this is not necessary; the BPE may be any geometrical shape oran irregular shape. For example, depending upon the need, a BPE may becircular, triangular, oval, trapezoidal, and other polygonal shapes. Theshape may be dependent on the configuration of the EC device, thesubstrate bearing the EC device (e.g. an irregular shaped window), oreven, e.g., a more efficient (e.g. in material removal, time, etc.)laser ablation pattern used to create it. In one embodiment, the BPEspans at least about 50% of the length of one side of an EC device. Inone embodiment, the BPE spans at least about 80% of the length of oneside of an EC device. Typically, but not necessarily, the BPE is wideenough to accommodate the bus bar, but should allow for some space atleast between the active EC device stack and the bus bar. In oneembodiment, the BPE is substantially rectangular, the lengthapproximating one side of the EC device and the width is between about 5mm and about 15 mm, in another embodiment between about 5 mm and about10 mm, and in yet another embodiment between about 7 mm and about 9 mm.As mentioned, a bus bar may be between about 1 mm and about 5 mm wide,typically about 3 mm wide.

As mentioned, the BPE is fabricated wide enough to accommodate the busbar's width and also leave space between the bus bar and the EC device(as the bus bar is only supposed to touch the lower conductive layer).The bus bar width may exceed that of the BPE (and thus there is bus barmaterial touching both the lower conductor and glass (and/or diffusionbarrier) on area 140), as long as there is space between the bus bar andthe EC device (in embodiments where there is an L3 isolation scribe, thebus bar may contact the deactivated portion, e.g. see 145 in FIG. 1A).In embodiments where the bus bar width is fully accommodated by the BPE,that is, the bus bar is entirely atop the lower conductor, the outeredge, along the length, of the bus bar may be aligned with the outeredge of the BPE, or inset by about 1 mm to about 3 mm. Likewise, thespace between the bus bar and the EC device is between about 1 mm andabout 3 mm, in another embodiment between about 1 mm and 2 mm, and inanother embodiment about 1.5 mm. Formation of BPEs is described in moredetail below, with respect to an EC device having a lower electrode thatis a TCO. This is for convenience only, the electrode could be anysuitable electrode for an optical device, transparent or not.

To make a BPE, an area of the bottom TCO (e.g. first TCO) is cleared ofdeposited material so that a bus bar can be fabricated on the TCO. Inone embodiment, this is achieved by laser processing which selectivelyremoves the deposited film layers while leaving the bottom TCO exposedin a defined area at a defined location. In one embodiment, theabsorption characteristics of the bottom electrode and the depositedlayers are exploited in order to achieve selectivity during laserablation, that is, so that the EC materials on the TCO are selectivelyremoved while leaving the TCO material intact. In certain embodiments,an upper portion (depth) of the TCO layer is also removed in order toensure good electrical contact of the bus bar, e.g., by removing anymixture of TCO and EC materials that might have occurred duringdeposition. In certain embodiments, when the BPE edges are lasermachined so as to minimize damage at these edges, the need for an L3isolation scribe line to limit leakage currents can be avoided—thiseliminates a process step, while achieving the desired deviceperformance results.

In certain embodiments, the electromagnetic radiation used to fabricatea BPE is the same as described above for performing edge deletion. The(laser) radiation is delivered to the substrate using either opticalfiber or the open beam path. The ablation can be performed from eitherglass side or the film side depending on the choice of theelectromagnetic radiation wavelength. The energy density required toablate the film thickness is achieved by passing the laser beam throughan optical lens. The lens focuses the laser beam to the desired shapeand size, e.g. a “top hat” having the dimensions described above, in oneembodiment, having an energy density of between about 0.5 J/cm² andabout 4 J/cm². In one embodiment, laser scan overlapping for BPE is doneas described above for laser edge deletion. In certain embodiments,variable depth ablation is used for BPE fabrication. This is describedin more detail below.

In certain embodiments, e.g. due to the selective nature of theabsorption in an EC film, the laser processing at the focal planeresults in some amount (between about 10 nm and about 100 nm) ofresidue, e.g. tungsten oxide, remaining on the exposed area of the lowerconductor. Since many EC materials are not as conductive as theunderlying conductor layer, the bus bar fabricated on this residue doesnot make full contact with the underlying conductor, resulting involtage drop across the bus bar to lower conductor interface. Thevoltage drop impacts coloration of the device as well as impacts theadhesion of the bus bar to the lower conductor. One way to overcome thisproblem is to increase the amount of energy used for film removal,however, this approach results in forming a trench at the spot overlap,unacceptably depleting the lower conductor. To overcome this problem thelaser ablation above the focal plane is performed, i.e. the laser beamis defocused. In one embodiment, the defocusing profile of the laserbeam is a modified top hat, or “quasi top hat.” By using a defocusedlaser profile, the fluence delivered to the surface can be increasedwithout damaging the underlying TCO at spot overlap region. This methodminimizes the amount of residue left in on the exposed lower conductorlayer and thus allows for better contact of the bus bar to the lowerconductor layer.

Referring again to FIGS. 4A and 4B, after forming the BPE, bus bars areapplied to the device, one on exposed area 435 of the first conductorlayer (e.g., first TCO) and one on the opposite side of the device, onthe second conductor layer (e.g., second TCO), on a portion of thesecond conductor layer that is not above the first conductor layer, see425. This placement of the bus bar 1 on the second conductor layeravoids coloration under the bus bar (analogous to bus bar 1 in FIG. 2Aor 3) and the other associated issues with having a functional deviceunder this bus bar. In this example, there are no laser isolationscribes necessary in fabrication of the device—this is a radicaldeparture from conventional fabrication methods, where one or moreisolation scribes leave non-functional device portions remaining in thefinal construct.

FIG. 4B indicates cross-section cuts Z-Z′ and W-W′ of device 440. Thecross-sectional views of device 440 at Z-Z′ and W-W′ are shown in FIG.4C. The depicted layers and dimensions are not to scale, but are meantto represent functionally the configuration. In this example, thediffusion barrier was removed when width A and width B were fabricated.Specifically, perimeter area 140 is free of first conductor layer anddiffusion barrier; although in one embodiment the diffusion barrier isleft intact to the edge of the substrate about the perimeter on one ormore sides. In another embodiment, the diffusion barrier is co-extensivewith the one or more material layers and the second conductor layer(thus width A is fabricated at a depth to the diffusion barrier, andwidth B is fabricated to a depth sufficient to remove the diffusionbarrier). In this example, there is an overlapping portion, 445, of theone or more material layers about three sides of the functional device.On one of these overlapping portions, on the second TCO, bus bar 1 isfabricated. In one embodiment, a vapor barrier layer is fabricatedco-extensive with the second conductor layer. A vapor barrier istypically highly transparent, e.g. aluminum zinc oxide, a tin oxide,silicon dioxide and mixtures thereof, amorphous, crystalline or mixedamorphous-crystalline. In this embodiment, a portion of the vaporbarrier is removed in order to expose the second conductor layer for busbar 1. This exposed portion is analogous to area 435, the BPE for busbar 2. In certain embodiments, the vapor barrier layer is alsoelectrically conductive, and exposure of the second conductor layer neednot be performed, i.e. the bus bar may be fabricated on the vaporbarrier layer. For example, the vapor barrier layer may be ITO, e.g.amorphous ITO, and thus be sufficiently electrically conductive for thispurpose. The amorphous morphology of the vapor barrier may providegreater hermeticity than a crystalline morphology.

FIG. 4C depicts the device layers overlying the first TCO, particularlythe overlapping portion, 445. Although not to scale, cross section Z-Z′for example, depicts the conformal nature of the layers of the EC stackand the second TCO following the shape and contour of the first TCOincluding the overlapping portion 445. Cross section Z-Z′ is reproducedin FIG. 7 and modified for illustrative purposes to show detail of aproblem sometimes encountered with such overlapping configurations.Referring to FIG. 7, the transition to overlap 445, where the upperdevice layers overlay the edge of the first TCO, e.g. depending upon thedevice materials and thickness of the layers, may form fissures, 700, asdepicted in the expanded portion (left). It is believed that thesefissures are due to the stress related to the upper device layers havingto follow an abrupt transition over the edge of the first TCO (in thisexample). Fissures 700 may form along the edges of the device where theoverlying layers cover such abrupt edges. These fissures may causeelectrical shorting, as there is an exposed path between the first andsecond TCO's, and ions may short the device as the ion conducting layer(or functional equivalent) is breached at the fissure. These shortscause coloration aberrations and poor performance of the electrochromicdevice. Embodiments herein overcome this problem by tapering (sloping orotherwise modifying) the lower device layers about at least a portion oftheir edge, particularly the lower transparent conducting layer, so thatthe overlying layers will not encounter such stresses. This is referredto herein as “edge tapering.” Although edge tapering is described incertain embodiments, other stress mitigation topology may be used suchas edge rounding, stepping, and beveling. Also, combinations of stressmitigation topology may be used.

Referring to FIG. 8A, the edge portion, 800, of the first TCO (diffusionbarrier not depicted) is tapered, for example, by laser ablation. Thus800 is an example of an edge taper. The tapered topography in thisexample is formed by a defocused laser (supra) so that smooth contoursare formed rather than abrupt edges. In this example, the taper is astepped contour, but this is not necessary. In a typical, butnon-limiting example, a first TCO might be between about 0.25 μm andabout 1 μm thick. The edge portion 800 having the tapered profile may bebetween about 0.25 μm and about 1000 μm wide, in another embodimentbetween about 0.5 μm and about 100 μm wide, in another embodimentbetween about 1 μm and about 10 μm wide. As described in relation toFIGS. 4A and 4B, the edge taper may be formed in the lower conductorlayer before or after polishing of the lower conductor.

Referring again to FIG. 8A and also FIG. 8B, after device fabrication(as indicated by the downward pointing arrow) a resulting electrochromicdevice as described above has overlapping portions of the one or morematerial layers and the top conductor layer around three sides. Theportion, 805, of the upper layers overlaps edge portion 800. Because ofthe sloped nature of edge portion 800, it is believed the overlyingdevice layers in portion 805 no longer experience the stress levelsotherwise encountered when an abrupt edge portion is below them. Portion805 gradually transitions to portion 810 which lies on the glasssubstrate (or the diffusion barrier, not shown, portion 810 is analogousto portion 445 in FIG. 4C). In this example, the edge taper 800 isfabricated on three sides of the first TCO in accord with fabricationmethods described herein, though, it can be done along any fraction ofthe perimeter of the TCO remaining after edge deletion (including theedge portion of the TCO along the substrate edge, i.e. that not removedby edge deletion). In one embodiment, edge taper is performed only aboutthe perimeter edge of the TCO formed by edge deletion. In oneembodiment, edge taper is performed only along that portion of theperimeter edge of the TCO formed by edge deletion and opposite side ofthe device as the BPE.

Although FIG. 8A depicts the lower conductor layer as tapered, this neednot be the case. Edge tapering can be done, e.g., after one or moreother layers have been deposited on the lower conductor layer so long asthe overall result is lowering of stress of subsequently depositedlayers. One embodiment is an electrochromic device with one or morelayers below the uppermost layer having an edge taper on at least someportion of their perimeter edge. One embodiment is an electrochromicdevice with one or more layers below the uppermost layer having a stressmitigation topology on at least some portion of their perimeter edge.The stress mitigation topology may include edge taper, edge rounding,stepping and/or beveling.

One embodiment is a method of fabricating an optical device, the methodincluding tapering one or more edges of an underlying material layerprior to fabrication of overlapping layers thereon. In one embodiment,the underlying material layer is the lower conductor layer. In oneembodiment, tapering one or more edges of the lower conductor layerincludes laser ablation. In one embodiment the laser is defocused so asto create smooth contours in the tapered edge portion. In oneembodiment, the lower conductor layer is polished before the edge taper.In one embodiment, the lower conductor layer is polished after the edgetaper.

As described, one or more laser isolation scribes may be needed,depending upon design tolerances, material choice and the like. FIG. 4Gdepicts top-views of three devices, 440 a, 440 b and 440 c, each ofwhich are variations on device 440 as depicted in FIGS. 4B and 4C.Device 440 a is similar to device 440, but includes L2 scribes (seeabove) that isolate first portions of the EC device along the sidesorthogonal to the sides with the bus bars. Device 440 b is similar todevice 440, but includes an L3 scribe isolating and deactivating asecond portion of the device between the bus bar on the first (lower)conductor layer and the active region of the device. Device 440 c issimilar to device 440, but includes both the L2 scribes and the L3scribe. Although the scribe line variations in FIG. 4G are described inreference to devices 440 a, 440 b and 440 c, these variations can beused for any of the optical devices and lites of embodiments describedherein. Depending upon device materials, process conditions, aberrantdefects found after fabrication, etc., one or more of these scribes maybe added to ensure proper electrical isolation of the electrodes andtherefore device function. Any of these devices may have a vapor barrierapplied prior to, or after, one or all of these scribes. If appliedafter, the vapor barrier is not substantially electrically conductive;otherwise it would short out the device's electrodes when filling thelaser scribe trenches. The above-described edge tapering may obviate theneed for such scribes.

Referring again back to FIG. 7, the right side of FIG. 7 includes adetailed portion of the cross section Z-Z′ illustrating a problemsometimes encountered with BPE formation. Specifically, during laserablation of the bus bar pad expose area, upon which bus bar 2 resides inthis figure, the laser may not ablate away the top layers or ablate thelower conductor layer (first TCO in this instance) uniformly. Thus,there may be problematic issues with proper electrical connectivitybetween the bus bar and the lower conductor layer in areas 705. Theseissues are described in more detail with reference to FIGS. 9A and 9B.

Referring to FIG. 9A, a cross section of an electrochromic device, 900,having a top transparent conductor layer 905, a device stack, 910, and alower transparent conductor layer, 915. On a BPE of lower conductorlayer 915, is a bus bar, 920, e.g., a silver ink bus bar. In the lowerportion of FIG. 9A, in detail, is shown a problem with the BPE portionof layer 915. Depending upon the device materials, laser settings,device state, etc., the BPE may not be of uniform thickness. In thisexample, the laser ablation was uneven, leaving areas, 930, whereconductor layer 915 was completely removed, and areas, 925, where layer915 remains. Areas 930 prevent electrical conduction to the device stackdue to cutting off electrical connectivity in the lower TCO. Areas 930typically span some portion of the BPE, if not all, and thus can be aproblem. FIG. 9B shows another problem that may occur. If the laser doesnot ablate deeply enough, in this example through the device stack, thenthere may be poor electrical connectivity between lower conductor 915and bus bar 920. In this example, there is electrical connectivitybetween bus bar 920 and conductor layer 915 in area 935, where thedevice stack was penetrated by the laser during BPE, but a large areaportion of the device stack remains between bus bar 920 and conductorlayer 915 at area 940. So, as illustrated in FIG. 9A, the laser mayablate too deeply, and as illustrated in FIG. 9B, the laser may notablate sufficiently over the entire area of the BPE. This can happen,e.g., due to film absorption drift during laser ablation, bothintra-device and inter-device. Methods described herein overcome theseissues by applying varying laser ablation levels, e.g., along individualscribe lines during BPE fabrication. This is described in more detail inrelation to FIGS. 10A-F.

FIG. 10A depicts a cross sectional portion of an electrochromic device,1000. The lower TCO is ablated in areas 1005 along one side to form aBPE, 435. In this example, each of three areas 1005 is ablated with adefocused laser such that the cross section is concave has depicted. Inthis example, each of the scribe lines is made at the same laser fluencelevel. Also, no overlap of the laser ablations was used, so that thereare raised regions (in this case ridges) of the TCO material remainingbetween adjacent ablation lines. This is one example of using laserablation of an overlying material down to an underlying conductor layerusing varying laser ablation levels along a plurality of individualscribes. There are essentially three “knobs” for achieving variableablation depth: pulse duration, fluence level and overlap of laser spotand/or pattern (line, shape formed by positioning of individual spots).In certain embodiments 100% overlap is used, e.g., multiple shots on asingle spot location or multiple lines across the same area. Embodimentsherein for achieving varying ablation depth use any one of these or anycombination thereof.

One embodiment is a method of fabricating a BPE, the method comprisinglaser ablation of overlying material down to an underlying TCO layerusing varying laser ablation levels along a plurality of individualscribe lines during fabrication of the BPE. In one embodiment, each ofthe individual scribe lines, of the plurality of scribe lines, isscribed using a quasi top hat at the same fluence level. Other patterns,besides lines, may be used so long as there is varying ablation depth.For example, a laser spot may be applied in a checkerboard pattern, withor without overlap of adjacent spots, where individual spots applydifferent pulse times to achieve varying ablation depth. In certainembodiments, at least two individual scribe lines, of the plurality ofscribe lines, are scribed using a different fluence level for each line.Such embodiments are described in more detail below.

FIG. 10B depicts a cross sectional portion of an electrochromic device,1010, of an embodiment. The electrochromic device, 1010, has a BPE 435formed via laser ablation of the lower TCO using varying ablation depthalong a plurality of laser ablation lines 1015, 1020 and 1025, along oneedge of the device. In this example, the lines are formed by overlappinglaser spots along each line, but where each line uses a differentoverlap percentage of the individual spots. In this example, there isalso overlap of the lines; however in some embodiments there is nooverlap between one or more lines. FIG. 10C shows a top view of BPE 435(any device described herein may have a BPE as described in relation toFIGS. 10A-F) that is made from three lines 1015, 1020 and 1025. Theselines each are of varying depth of ablation into the TCO relative to theother lines, but have substantially the same depth of ablation withinany given line. By using varying ablation depth, e.g. using differentfluence level of the laser spot, overlap in the spots or lines, pulseduration, and combinations thereof, the BPE has multiple depth profilesand accounts for problems associated with variation in film absorptionduring laser ablation. That is, if the laser doesn't ablate deeplyenough, or ablates too deeply, there is still a sufficient amount ofexposed TCO in order to make good electrical contact with the bus baralong the device edge and thus good performance and coloration frontduring operation of the device. In this example, the TCO is ablatedprogressively more deeply as the laser is moved from each line to thenext, so that the BPE is progressively thinner at the outer edge andthicker at the innermost surface near the device stack. The BPE depictedin FIG. 10B shows gently sloped transitions between lines indicatingthat laser ablation paths were overlapping partially. The final BPE is athree-stepped construct as depicted. By using varying ablation depth,good electrical contact between the bus bar and the BPE is ensuredbecause even if there is absorption variation, there will be completepenetration to the lower TCO by at least one of the ablation lines.

In one embodiment, laser ablation is used to remove material from atleast two lines along the edge of the EC device, along each line at adifferent ablation depth. In one embodiment, the ablation depth isselected from at least the upper 10% of the lower TCO, at least theupper 25% of the lower TCO, at least the upper 50% of the lower TCO, andat least the upper 75% of the lower TCO.

FIG. 10D depicts a cross sectional portion of an electrochromic device,1030, of an embodiment. Referring to FIG. 10D, even if the materialsabove the bottom TCO vary in absorption from the calculated value, e.g.the laser ablation does not dig as deeply into the stack as calculateddue to loss of absorption for some reason, since there are multiplelines at different depths, the BPE process is successful, i.e. goodelectrical connectivity with bus bar 920 is achieved. In the exampledepicted in FIG. 10D, the laser didn't ablate as deeply as calculated,e.g. line 1015 has some EC stack material remaining which wouldinterfere with electrical contact between the BPE and a bus bar. But,lines 1020 and 1025 did penetrate down to the TCO and thus bus bar 920makes good electrical contact with the lower TCO. FIG. 10E depicts across sectional portion of an electrochromic device, 1040, of anembodiment. FIG. 10E depicts the scenario where the laser penetratesmore deeply than calculated, e.g. when the absorption of the materiallayers drifts to a more increased state than expected. In this example,line 1025 has insufficient TCO thickness to conduct electricityproperly, but the remaining lines, 1015 and 1020, allow for goodelectrical connection with bus bar 920.

FIG. 10F depicts a cross sectional portion of an electrochromic device,1050, of an embodiment. FIG. 10F illustrates that the varying depth ofthe laser lines need not be from less depth to more depth as one movesfrom inner portion of BPE to outer portion of BPE. In this example, thelaser ablation depth is configured such that the BPE is thicker furthestfrom the EC device and thinnest closest to the device edge. This patternmay have advantage when, e.g., it is desirable to make absolutely surethere is no stack material between where the bus bar is fabricated onthe BPE and the device stack. By penetrating more deeply into the TCO onthe line (1015) proximate the EC device, this is achieved. In oneembodiment, the laser is configured to progressively remove more of theunderlying conductor layer in each of the plurality of scribe lines, theablation area of each scribe line is overlapped at least partially withthe ablation area of the previous scribe line, and plurality of scribelines are fabricated with most removal of underlying conductor layernearest to the device stack and least removal of underlying conductivelayer furthest from the device stack. In one embodiment, the laser isconfigured to progressively remove more of the underlying conductorlayer in each of the plurality of scribe lines, the ablation area ofsaid at least two scribe lines is overlapped at least partially with theablation area, and plurality of scribe lines are fabricated with leastremoval of underlying conductor layer nearest to the device stack andmost removal of underlying conductive layer furthest from the devicestack.

Although the varying fluence and/or overlap and/or pulse duration oflaser ablation spots, lines or patterns in order to vary the ablationdepth is described in reference to BPE fabrication, it can also be usedto create the edge taper as described herein. Nor are these methodslimited to those embodiments, e.g., they can also be used to createisolation trenches, e.g., where two or more lines are ablated atdifferent depths to ensure proper electrical (and optionally ionic)isolation of one section of an EC device from another. In oneembodiment, an L3 scribe is fabricated where two or more scribe linesare used to fabricate the L3 scribe and at least two scribe lines eachhave a different ablation depth, with or without overlap of the lines.

The above described fabrication methods are described in terms ofrectangular optical devices, e.g. rectangular EC devices. This is notnecessary, as they also apply to other shapes, regular or irregular.Also, the arrangement of overlapping device layers as well as BPE andother features may be along one or more sides of the device, dependingupon the need. In order to more fully describe the scope of theembodiments, these features are described in more detail below withrespect to other shapes and configurations. As described in relation toFIGS. 4A and 4B, the fabrications described below may also include otherfeatures such as polish of the lower transparent conductor layer, edgetaper, multi-depth ablated BPE, etc. Description of these features wasnot given so as to avoid repetition, but one embodiment is any of thedevice configurations described below with one or more of the featuresdescribed in relation to FIGS. 4A and 4B.

FIG. 4D is a top view schematic drawing depicting fabrication stepsanalogous to that described in relation to the rectangular substrate inFIG. 4B, but on a round substrate, according to an embodiment. Thesubstrate could also be oval. Thus as described previously, a firstwidth A is removed, see 405. The one or more material layers and secondconductor layer (and optionally a vapor barrier) are applied over thesubstrate, see 410. A second width B is removed from the entireperimeter of the substrate, see 415 (140 a is analogous to 140). A BPE,435 a, is fabricated as described herein, see 420. Bus bars are applied,see 425, to make device 440 d (thus, for example, in accord with methodsdescribed above, the at least one second bus bar is applied to thesecond conducting layer proximate the side of the optical deviceopposite the at least one exposed portion of the first conductinglayer).

FIG. 4E is a top view schematic depicting fabrication analogous to thatdescribed in relation to the rectangular substrate in FIG. 4B, but forangled bus bar application of an embodiment. Thus as describedpreviously, a first width A is removed, see 405, in this example fromtwo orthogonal sides (one or both of the resulting edges of the lowerTCO may have edge taper). The one or more material layers and secondconductor layer (and optionally a vapor barrier) are applied over thesubstrate, see 410. A second width B is removed from the entireperimeter of the substrate, see 415. A BPE, 435 b, is fabricated asdescribed herein; see 420, in this example along orthogonal sidesopposite those from which width A was removed. Bus bars are applied, see425, to make device 440 e (thus, for example, in accord with methodsdescribed above, the at least one second bus bar is applied to thesecond conducting layer proximate the side of the optical deviceopposite the at least one exposed portion of the first conductinglayer). Angled bus bars are described in U.S. patent application Ser.No. 13/452,032, filed Apr. 20, 2012, and titled “Angled Bus Bar,” whichis hereby incorporated by reference in its entirety. Angled bus barshave the advantages of decreasing switching speed and localized current“hot spots” in the device as well as more uniform transitions.

Whatever the shape of the device, it can be incorporated into aninsulated glass unit. Preferably, the device is configured inside theIGU so as to protect it from moisture and the ambient. FIG. 4F depictsIGU fabrication where the optical device, e.g. an electrochromic deviceis sealed within the IGU. IGU, 460, including a first substantiallytransparent substrate, 445, a spacer, 450, and a second substantiallytransparent substrate, 455. Substrate 445 has an electrochromic devicefabricated thereon (bus bars are shown as dark vertical lines onsubstrate 445). When the three components are combined, where spacer 450is sandwiched in between and registered with substrates 445 and 455, IGU460 is formed. The IGU has an associated interior space defined by thefaces of the substrates in contact with adhesive sealant between thesubstrates and the interior surfaces of the spacer, in order tohermetically seal the interior region and thus protect the interior frommoisture and the ambient. This is commonly referred to as the primaryseal of an IGU. A secondary seal includes an adhesive sealant appliedaround the spacer and between the panes of glass (the spacer has smallerlength and width than the substrates so as to leave some space betweenthe glass substrates from the outer edge to the spacer; this space isfilled with sealant to form the secondary seal). In certain embodiments,any exposed areas of the first conducting layer are configured to bewithin the primary seal of the IGU. In one embodiment, any bus bars arealso configured to be within the primary seal of the IGU. In oneembodiment, the area of the second conductor layer that is not over thefirst conductor layer is also configured to be within the primary sealof the IGU. Conventional electrochromic IGU's configure the bus barseither outside the spacer (in the secondary seal) or inside the spacer(in the interior volume of the IGU) in the viewable area of the IGU(sometimes one in the secondary seal, the other in the viewable area).Conventional electrochromic IGU's also configure the EC device edgeseither running to the substrate edge or inside the spacer (within theinterior volume of the IGU). The inventors have found it advantageous toconfigure the bus bars, laser scribes, and the like to be under thespacer, so as to keep them from the viewable area and, e.g., to free upthe secondary seal so that electrical components therein do notinterfere with the aforementioned features. Such IGU configurations aredescribed in U.S. patent application Ser. No. 13/456,056, titled“Electrochromic Window Fabrication Methods,” filed Apr. 25, 2012, whichis hereby incorporated by reference in its entirety. Controllers thatfit into the secondary seal are described in U.S. Pat. No. 8,213,074,titled “Onboard Controllers for Multistate Windows,” filed Mar. 16,2011, which is hereby incorporated by reference in its entirety. Methodsdescribed herein include sealing any exposed areas of the firstconductor layer, edges of the device or overlapping regions of the oneor more material layers, and the second conductor layer in the primaryseal of the IGU. With or without a vapor barrier layer, such as siliconoxide, silicon aluminum oxide, silicon oxynitride, and the like, thissealing protocol provides superior moisture resistance to protect theelectrochromic device while maximizing viewable area.

In certain embodiments, the fabrication methods described herein areperformed using large-area float glass substrates, where a plurality ofEC lites are fabricated on a single monolithic substrate and then thesubstrate is cut into individual EC lites. Similar, “coat then cut”methods are described in U.S. Pat. No. 8,164,818, filed Nov. 8, 2010,and titled, “Electrochromic Window Fabrication Methods,” which is herebyincorporated by reference in its entirety. In some embodiments, thesefabrication principles are applied to the methods described herein,e.g., in relation to FIGS. 4A-4G.

FIGS. 4H and 4I depict an EC lite fabrication process flow, similar tothat described in relation to FIG. 4A, but carried out on a large-areasubstrate as applied to coat then cut methods, according to embodiments.These fabrication methods can be used to make EC lites of varyingshapes, e.g., as described herein, but in this example, rectangular EClites are described. In this example, substrate 430 (e.g. as describedin relation to FIG. 4A, coated with a transparent conducting oxidelayer) is a large-area substrate, such as float glass, e.g. a sheet ofglass that is 5 feet by 10 feet. Analogous to operation 405 as describedin relation to FIG. 4A, edge deletion at a first width, A, is performed.Edge taper and/or polish may also be performed. In this example, sincethere are to be a plurality of EC devices (in this example, 12 devices)fabricated on a large substrate, the first width A may have one or morecomponents. In this example, there are two components, A₁ and A₂, towidth A. First, there is a width A₁, along the vertical (as depicted)edges of the substrate. Since there are neighboring EC devices, thewidth A₁ is reflected in a coating removal that is twice the width A₁.In other words, when the individual devices are cut from the bulk sheet,the cuts in between neighboring devices along the vertical (as depicted)dimension will evenly bi-furcate the area where the coating is removed.Thus “edge deletion” in these areas accounts for where glass edges willeventually exist after the glass is cut (see for example FIG. 4I).Second, along the horizontal dimension, a second A-width component, A₂,is used. Note, in certain embodiments width A₁ is used about the entireperimeter of the substrate; however, in this example more width isprovided to accommodate the bus bar that will fabricated on the toptransparent conductor layer (e.g. see FIG. 4C, bus bar 1). In thisexample, width A₂ is the same both at the top and bottom edge of thesubstrate and between neighboring EC devices. This is because thefabrication is analogous to that described in relation to FIG. 4B, i.e.,where the EC devices are cut from the substrate along the bottom of edgeof the transparent conductor area for each device (see FIG. 4G).

Next, in operation 410, the remaining layers of the EC device aredeposited over the entire substrate surface (save any areas where clampsmight hold the glass in a carrier, for example). The substrate may becleaned prior to operation 410, e.g., to remove contaminants from theedge deletion. Also edge taper on each of the TCO areas may beperformed. The remaining layers of the EC device encapsulate theisolated regions of the transparent conductor on the substrate, becausethey surround these areas of transparent conductor (except for the backface which resides against the substrate or intervening ion barrierlayer). In one embodiment, operation 410 is performed in acontrolled-ambient all PVD process, where the substrate doesn't leavethe coating apparatus or break vacuum until all the layers aredeposited.

In operation 415, edge deletion at a second width, B, narrower than thefirst width A, is performed. In this example, second width B is uniform.In between neighboring devices, second width B is doubled to account forcutting the substrate along lines evenly between two devices so that thefinal devices have a uniform edge delete about them for the spacer toseal to the glass when an IGU is fabricated from each EC device. Asillustrated in FIG. 4H, this second edge deletion isolates individual EClites on the substrate. In certain embodiments, the second width B maybe much smaller than that needed to accommodate a spacer for IGUfabrication. That is, the EC lite may be laminated to another substrateand thus only a small edge delete at width B, or in some embodiments noedge delete at the second width B is necessary.

Referring to FIG. 4I, operation 420 includes fabricating a BPE, 435,where a portion of the EC device layers are removed to expose the lowerconductor layer proximate the substrate. In this example, that portionis removed along the bottom (as depicted) edge of each EC device. Next,during operation 425, bus bars are added to each device. In certainembodiments, the EC lites are excised from the substrate prior to busbar application. The substrate now has completed EC devices. Next, thesubstrate is cut, operation 470, to produce a plurality of EC lites 440,in this example 12 lites. This is a radical departure from conventionalcoat then cut methods, where here, fully functional EC devices can befabricated, including bus bars on a large area format glass sheet. Incertain embodiments the individual EC lites are tested and optionallyany defects mitigated prior to cutting the large format sheet.

Coat and then cut methods allow for high throughput manufacture becausea plurality of EC devices can be fabricated on a single large areasubstrate, as well as tested and defect-mitigated prior to cutting thelarge format glass sheet into individual lites. In one embodiment, thelarge format glass pane is laminated with individual strengthening panesregistered with each EC device prior to cutting the large format sheet.The bus bars may or may not be attached prior to lamination; forexample, the mate lite may be coextensive with an area allowing someexposed portions of the top and bottom TCO's for subsequent bus barattachment. In another example, the mate lite is a thin flexiblematerial, such as a thin flexible glass described below, which issubstantially co-extensive with the EC device or the entire large formatsheet. The thin flexible mate lite is ablated (and lamination adhesive,if present in these areas) down to the first and second conductor layersso that bus bars may be attached to them as described herein. In yetanother embodiment, the thin flexible mate lite, whether co-extensivewith the entire large format sheet or the individual EC devices, isconfigured with apertures which are registered with the top conductorlayer and the BPE during lamination. The bus bars are attached eitherbefore or after lamination with the mate lite, as the apertures allowfor either operation sequence. The lamination and bus bar attachment mayseparately be performed prior to cutting the large sheet, or after.

In certain embodiments, when laminating, bus bar ink may be appliedprior to lamination, where the ink is applied to the BPE and upper TCO,then pressed out from between these areas when laminated, e.g. to anaperture in the mate lite or continuing around the edge of the laminate,to allow lead attach at a point located outside the laminated area. Inanother embodiment, a flat foil tape is applied to the top conductor andthe BPE, the foil tape extends beyond the laminated region, such thatwires can be soldered to the tape after lamination. In theseembodiments, cutting must precede lamination unless, e.g., thelamination mate lites do not cover the entire surface of the largeformat substrate (e.g. as described in relation to roll-to-rollembodiments herein).

Lites 440, laminated or not, may be incorporated into an IGU, e.g. asdepicted in FIG. 4F. In one embodiment, the individual EC lites areincorporated into an IGU and then one or more of the EC lites of the IGUis laminated with a strengthening pane (mate lite) as described hereinor in U.S. Pat. No. 8,164,818. In other embodiments, e.g. as describedherein, lamination may include a flexible substrate, e.g. theaforementioned lamination of an IGU where the mate lite is a flexiblesubstrate, or e.g., lamination of the EC lite directly to a flexiblesubstrate. Further such embodiments are described in relation to FIG.4J.

FIG. 4J depicts roll-to-roll processing, 475, forming laminates ofelectrochromic devices where the lamination uses a flexible mate lite. Asubstrate, 476, is fed into a lamination line, in this example includinga conveyer 477. Substrate 476 may be an IGU with at least one EC liteincorporated, or substrate 476 can be a monolithic EC device, e.g., asdescribed herein or substrate 476 can be a large format substrate with aplurality of EC lites fabricated thereon. In this example, a thin andflexible substrate, 478, in this case a glass substrate is fed from aroll into the lamination line. In one embodiment one or more rolls areapplied in parallel to a large format glass sheet including a pluralityof EC devices, e.g., as described in relation to FIG. 4I. For example,three separate and parallel rolls of the flexible substrate are fed intoa lamination line that laminates the large format glass substratelengthwise or widthwise such that three columns or rows of EC devices(see FIG. 4I, upper portion) are each laminated with the flexiblesubstrate. Thus using roll-to-roll processing, large format glass sheetscan be laminated with flexible mate lite material and cut intoindividual EC lites. The large format glass sheet may be cut as each rowis laminated or after the entire sheet is laminated. In certainembodiments, individual EC lites, or IGU's containing them, arelaminated with roll-to-roll processing. More detail of roll-to-rollprocessing is described below.

Exemplary flexible substrates include thin and durable glass materials,such as Gorilla® Glass (e.g. between about 0.5 mm and about 2.0 mmthick) and Willow™ Glass, commercially available from Corning,Incorporated of Corning N.Y. In one embodiment, the flexible substrateis less than 0.3 mm thick, in another embodiment the flexible substrateis less 0.2 mm thick, and in another embodiment the flexible substrateis about 0.1 mm thick. In certain embodiments, the thin flexiblelow-sodium substrate may be less than 0.1 mm thick. Such substrates canbe used in roll-to-roll processing. Referring again to FIG. 4J, adhesiveis applied to substrate 476, flexible substrate 478, or both. Rollers479 apply sufficient pressure to ensure good bonding between substrate476 and flexible substrate 478. Flexible substrate 478 is cut to matchits lamination partner 476, e.g., using a laser 480. The final laminatestructure, 481, results. Using this roll-to-roll method, monolithic ECdevices, IGU's or large format glass sheets bearing a plurality of EClites can be strengthened with a thin flexible strengthening pane. Thesemethods apply to any EC substrate, described herein or otherwise. In oneembodiment, the monolithic EC lites as depicted in FIG. 4I, e.g. havingbeen cut from the large area substrate, are fed into the lamination lineto be laminated with the flexible substrate. In another embodiment, thelarge area substrate, having a plurality of EC devices fabricatedthereon, is laminated with a flexible substrate of corresponding width,and after lamination, the individual, now laminated, EC devices are cutfrom the large area laminate, e.g., by row as lamination finishes orafter lamination of the entire large format sheet. In anotherembodiment, the large area substrate, having a plurality of EC devicesfabricated thereon, is laminated with a plurality of flexible substratesof corresponding width or length to individual EC lites, and afterlamination, the EC devices, now laminated, are cut from the large arealaminate, e.g. individually, or by row (or column).

In certain embodiments, the thin flexible substrate is laminated to anon-annealed glass lite, e.g. a tempered or heat strengthened glasslite, and then the laminate produced is used as a substrate for anoptical coating. Although not limited in this way, these embodiments areparticularly useful for applying a sputtered inorganic EC device to aflexible substrate, where the processing conditions required for the ECdevice fabrication include heating the substrate, particularly annealingat temperatures of between about 300° C. and 450° C. Also, large sheetsof these thin flexible substrates may be easier to handle with a supportsubstrate. However, since flexible glass substrates may be very lowdefect surfaces and low-sodium, they can be excellent substrates onwhich to fabricate low-defect EC devices. Embodiments where a thinflexible substrate, for example the aforementioned low-sodium thinflexible glass, with or without a pre-applied transparent conductorlayer, e.g. those commercially available from Corning, Incorporated ofCorning N.Y., is first laminated to a support lite, and then an ECdevice is fabricated thereon, are described in relation to FIG. 4K.

FIG. 4K describes aspects of a process flow, 482, for fabricating anoptical device. Process flow 482 is described in terms of a thinflexible low-sodium glass laminated to a tempered glass or heatstrengthened glass lite; however, that is only one embodiment of thelamination portion of the process flow. For example, a thin flexibleglass can be laminated to a plastic substrate and then an EC devicefabricated thereon (e.g. where the EC fabrication process does notrequire temperatures which the laminate could not withstand).

Referring to FIG. 4K, first, a thin flexible glass is laminated to asupport lite, e.g. a tempered or heat strengthened lite, between about 2mm and about 25 mm thick, in another embodiment between about 2 mm andabout 12 mm thick, and in yet another embodiment between about 2 mm andabout 6 mm thick, see 483. If the thin flexible glass includes atransparent conductor layer, that layer may be positioned facing awayfrom the lamination adhesive, in order to fabricate the optical deviceon the transparent conductor layer and thus use it as one of theconductors of the optical device. The transparent conductor layer can beoriented toward the lamination adhesive, e.g., if an extra low-E coatingis desired in the final laminate structure, and in such embodiments, theother side of the thin flexible glass would need a transparent conductorlayer.

The lamination is performed with a lamination adhesive appropriate forthe optical device fabrication; i.e., one that will withstand theconditions of the fabrication process, including any annealing, bakingor firing steps. In certain embodiments, a high-temperature laminationadhesive is used, e.g. a silicone based adhesive. One type of suchsilicone based adhesives is described in US Patent Publication, US2012/0156457, filed Feb. 24, 2012, which is herein incorporated byreference in its entirety. The silicon based adhesive described in theaforementioned patent publication allows a thin flexible substrate to bebonded to a supporting substrate and then debonded from the supportingsubstrate after processing, particularly high temperature processing,e.g. at or about 400° C. Embodiments herein are not limited tolamination adhesives that allow debonding (peelability) of the flexiblesubstrate from a support substrate. In certain embodiments, it isspecifically desired that the lamination bond be permanent. In lowertemperature regimes, e.g. in one embodiment less than 300° C., inanother embodiment less than 200° C., epoxy based lamination adhesivescan be used. Any suitable lamination adhesive will suffice, so long asthe adhesive holds up to the processing conditions for fabricating theoptical device. In some cases, the lamination adhesive is an opticallyclear adhesive. Silicone adhesives are an attractive choice because theycan be formulated to have low volatile organic components (low-VOC) oreven zero-VOC. In addition, silicon adhesives can be formulated toremain optically clear during processing. This is useful, e.g., whenusing the laminates described herein as substrates for an all inorganic,e.g. sputtered, and heat treated (annealed, baked or fired) EC coating,because, e.g. in an integrated vacuum coater system, volatile componentsare to be avoided as they can affect holding a stable vacuum and/orcontaminate the deposited (e.g. sputtered) layers. Typically, a siliconebased lamination adhesive will be cured at between 100° C. and about250° C. prior to fabricating an optical device thereon, but in certainembodiments the curing process is performed during EC fabrication. Thelaminate formed in step 483 should have a uniform surface, e.g., thelamination adhesive should be uniformly distributed, both in thicknessand devoid of bubbles, between the tempered lite and the flexibleannealed glass substrate. Having a uniform (e.g. substantially planar)surface on the flexible substrate is important for uniformity ofdeposited layers thereon. For an absorptive device, e.g., the laminationadhesive should have good clarity, low haze, and sufficient lighttransmission for the ultimate optical device's specifications. Thelamination layer can be colored, or not, depending on the need. Acolored lamination layer can be used to offset unwanted color in anotherpart of the optical device, or used to enhance an existing color. Ifyellowing of the lamination adhesive occurs during processing, thesupport lite's color may be chosen to make the final product's colorspace conform to specification. Dyes that may be used in the laminationlayer are preferably highly stable to heat and ultraviolet (UV)radiation. If inorganic pigments are chosen, they should not catalyzebreakdown of the lamination adhesive under heat or UV. In oneembodiment, the lamination adhesive is formulated to have lateral give,so that the difference in the coefficient of thermal expansion betweenthe support lite and the thin flexible lite is accommodated withoutbreakage due to thermal shock.

In one embodiment, the laminate is fabricated as described in relationto FIG. 4J, but where substrate 476 (e.g. a tempered or heatstrengthened glass or a plastic substrate) does not have an EC devicethereon. Laser 480 may be used not only to cut the laminate free fromthe bulk roll of 478, but also to perform an edge treatment as describedbelow. The flexible substrate, 478, may be a large format roll, e.g.one-half meter to three meters wide and, e.g., tens of meters orhundreds of meters long, e.g. up to 300 meters long. Multiple lites 476may be laminated in parallel (e.g. side by side). In one example, lites476 are arranged on a roller system in patterns that maximize efficientuse of the flexible substrate 476. This is illustrated in FIG. 4L.

FIG. 4L depicts a top view of a lamination apparatus, 490. Thelamination process performed in apparatus 490 is much like thatdescribed with respect to FIG. 4J, except substrates 476 do not have ECdevices thereon, they are support substrates for thin flexible substrate478, e.g. thin flexible annealed low-sodium glass. Substrates 476 arefed onto, e.g., roller conveyer 477, the lites are laminated asdescribed in relation to FIG. 4K, to form laminates 481 (in this exampleusing large rollers 479, however, such automated lamination may includelarge planar presses, vacuum bag technology, heaters and the like aswould be appreciated by skilled artisans). In this example, substrates476 are of varying sizes and shapes, and are arranged to maximize usablearea of flexible substrate 478 (in FIG. 4L, substrates 476 and laminates481 are depicted with solid white fill so as to simplify the figure).Substrates 476, e.g., may be as large as 72 inches×120 inches. In thisexample, as substrate 478 exits the lamination process (large rollers479), laminates 481 are still attached to the bulk substrate 478.Individual laminates 481 are cut free from the bulk sheet, e.g. using alaser (e.g. laser 480 in FIG. 4J) or electrothermally and/or mechanicalglass cutting. The excess thin glass 478 that is removed from theperimeter of each laminate can be recycled. In certain examples, theroller conveyer 477 transporting the substrates 476 may have narrowspacing (e.g., spacing between 1 inch and 3 inches), at least before thelamination process, between adjacent rollers to reduce the possibilityof breakage of the substrates. In addition or as an alternative, thesubstrates 476 may be heated before the lamination process such that thesubstrates 476 are placed under compression under cooling which mayfurther to reduce the possibility of breakage of the substrates 476.

When laminates 481 are cut from the bulk sheet, the thin flexiblesubstrate may be cut larger than support lite 476, this is depicted inFIG. 4M. Construct 491 is a laminate 481 cut free from the bulk sheet ofthin flexible glass 478, where a perimeter overhang of thin flexibleglass 478 remains (note lamination adhesive 493). This construct may bedesirable so that more precise cutting of the thin glass can be doneaway from the high throughput lamination setting. As depicted in FIG.4M, the thin glass may be cut to match the area of the support lite 476.FIG. 4M shows top and side views of this. FIG. 4N depicts that the thinflexible glass may be cut set-back (smaller area) than the support lite476 to make a laminate 492. This may be done to help protect the edgesof annealed glass. One of ordinary skill in the art would appreciatethat constructs 491, 481 and 492 may be fabricated without using a largeformat (e.g. a roll or large ribbon of) flexible glass. For example,using pre-cut flexible lites slightly larger than, the same size as, orsmaller than, the area of the support lite 476, constructs 491, 481 and492 maybe be fabricated, respectively.

Referring again to process flow 482 in FIG. 4K, an edge treatment isoptionally applied to the laminate, see 484. An edge treatment mayinclude a grinding and/or polishing procedure to improve the edgestrength or more fully protect and/or secure the edge of the thinflexible substrate. In one embodiment, the edge of the thin flexibleglass partner is heated to high temperature to melt the glass around theperimeter, thereby removing microfissures and inducing stress in theedge for added strength. In one embodiment, the flexible thin annealedglass' edge is ground and/or polished after lamination, e.g. laminate481 is a “rough cut” laminate, e.g. mechanically cut, that is putthrough an edge grind and polish process to strengthen the edge of thethin annealed lite (the tempered light typically will already have aground and polished edge). In the resulting structure, although the area(“footprint”) of the tempered support lite and the thin flexible liteare the same, the outermost edge of the thin glass is beveled, e.g. toapproximate the curvature of the tempered lite's ground (and optionallypolished) edge. This is depicted in FIG. 4O, laminate 481 a. The thinannealed lite of laminate 481 has a rectangular cross-section at theedge, but after edge grinding, and optionally polishing, the edge isrounded or angled and more resistant to breakage, see laminate 481 a.The surface areas of the mating surfaces adjacent to lamination adhesive493 are the same, there is no set back, yet the outer (rightmost) cornerof flexible glass 478's edge is protected by virtue of the edgecurvature (or angle). Since the support lite is typically a temperedglass lite with a pre-existing edge grind and polish, this edgetreatment may include only grinding and/or polishing or modification ofthe annealed glass edge. In some cases, edge treatment withgrinding/polishing as described with respect to FIG. 4P could requirefrequent treatment of the polishing wheel to remove residue.

While not wishing to be bound by theory, it is believed that when verythin flexible annealed glass is laminated to a thicker tempered lite,the edge grind and/or polish could be performed so as to remove materialfrom both lites of the laminate. That is, if a small thickness ofmaterial is to be ground from the tempered lite during the process, aslong as one does not penetrate the tension zone of the tempered lite,and sufficient material in the compression zone remains after the edgegrind, the laminate can be edge ground, where both the tempered lite andthe annealed lite are ground together to form an even curvature. Oneembodiment is a method of forming a laminate, including laminating atempered lite to a thinner annealed lite, and then edge grinding thelaminate where both the tempered lite and the annealed lite's edges areground simultaneously. The resulting edge would look much like that oflaminate 481 a, but may have better C2 symmetry along an axis centeredon and parallel to the cross section as depicted.

In typical embodiments a tempered or heat strengthened lite is used forthe support substrate, where the edge of the support substrate has aground and optionally polished edge prior to the lamination. Theflexible lite's edge is treated before or after lamination. For example,an epoxy (e.g., Somos® ProtoGen O-XT 18420 epoxy) may be applied to amechanically cut annealed thin flexible glass, before or after the thinflexible glass is fabricated into the aforementioned laminate. Sincemechanically cut glass has an edge strength that may not be as high aslaser or electrothermally cut glass, an edge adhesive, e.g. an epoxy, isapplied to the perimeter of the glass to prevent the glass from breakingor cracking under thermal stress. Certain epoxy adhesives can withstandhigh temperatures, e.g. between about 300° C. and about 400° C., but mayyellow under such conditions. Since the epoxy is at the edges, anyyellowing would not be a problem, as these edges would be hidden fromview when, e.g., the laminated pane is fabricated into an IGU orinstalled with an associated framing system. Other materials may beapplied to a mechanically cut annealed thin flexible glass, before orafter the thin flexible glass is fabricated into the aforementionedlaminate such as, for example, ABS plastic, polypropylene (e.g.,Polypro® PD626polypropylene), and Urethane/polypropylene blend (e.g.,such as Santoprene® Urethane/polypropylene blend). In addition, theflexible lite's edge may be treated before or after lamination edgetreatments to additional edge treatments. For example, acid etching ofthe edges could be used to blunt crack tips. In some cases, thetreatment of the flexible lite's edge may involve material tape, whichis wrapped around the edge. In some cases, the material tape may beencapsulated within the IGU frame such that it is not visible to aviewer.

FIG. 4P depicts cross sections of two laminates where an edge adhesive,495, is applied. In this figure, edge adhesive 495 is applied tolaminate 481 and 481 a. Note that the edge adhesive may coat not onlythe edge but part of the face of the laminate about the perimeter. Inone embodiment, the edge adhesive does not cover more than about a 1 mmwide band of the perimeter of the annealed glass lite of the laminate,in another embodiment, the edge adhesive does not cover more than abouta 2 mm wide band of the perimeter of the annealed glass lite of thelaminate, in yet another embodiment, the edge adhesive does not covermore than about a 3 mm wide band of the perimeter of the annealed glasslite of the laminate.

Edge adhesives, such as epoxy, may be formulated with very low viscosityin order to ensure that they not only cover the edge of the annealedlite, but also penetrate microcracks in the glass and bond themtogether. The edge adhesive may be applied in two or more applications,e.g., a low viscosity adhesive is applied to seal and bond anymicrocracks or defects in the glass edge, and then a more viscousadhesive is applied to provide a thicker barrier, e.g. a “bead” ofmaterial that serves as a bumper to protect the edge from physicalcontact during handling.

Application of an edge adhesive is optional, because in certainembodiments, the lamination adhesive is engineered to both serve as abonding agent between the two glass substrates, but also as an edgeadhesive as described above. In one embodiment, during the laminationprocess, sufficient lamination adhesive is squeezed from between thesubstrates so as to coat the edge of the thin flexible substrate andprovide an edge adhesive. This is illustrated in FIG. 4P, see laminate481 b. Laminate 481 b, in this example but not necessarily, has a setback thin annealed lite. Lamination adhesive 493 forms a bead around theperimeter edge of annealed lite 478 and protects it from breakage. Inother embodiments, any lamination adhesive is removed from the edges,and a separate edge adhesive is applied thereafter, e.g. a siliconebased lamination adhesive is used for lamination, and an epoxy edgeadhesive is applied thereafter. In one embodiment, both the laminationadhesive and an applied edge adhesive are used to protect the glassedge, for example a laminate such as 481 b may have an edge adhesiveapplied over the bead of lamination adhesive 493 about the perimeter ofthe laminate.

In one embodiment, etching, heating or the like is performed prior toapplication of an edge adhesive or in lieu of application of an edgeadhesive. For example, in one embodiment, a laser is used to strengthenthe edge of the thin flexible substrate, before and/or after laminationto the support substrate. Lasers may be used, e.g., to cut away weakedge material, or, e.g., to heat the edge and melt any microcracks,thereby adding stress and strength to the edge. In certain embodimentssome of the edge stress may be relieved during the heating associatedwith EC fabrication.

While not wishing to be bound by theory, it is believed that edgetreatments may not only improve durability of the laminate EC device inthe field (e.g. stability during thermal shock), but also improvedurability so that the laminate can survive high temperatures associatedwith certain EC fabrication processes.

Referring again to process flow 482 of FIG. 4K, the lamination ispreferably carried out in a clean, low-particulate environment. However,since the optical device fabrication occurs after lamination, thelaminate may optionally be cleaned prior to, e.g. EC device fabrication,see 485. Cleaning is performed, e.g., using commercially available glasscleaning apparatus.

After the optional edge treatment and/or optional cleaning, an EC deviceis fabricated on the thin flexible glass substrate, see 486. Exemplarymethods for fabricating EC devices are described herein, e.g. inrelation to FIG. 4A-E, although other methods can be used withoutescaping the scope of the “EC fabrication” aspect of process flow 482.Note, the optional polishing process (described herein) of the lowertransparent conductor layer may be avoided by using the thin flexibleannealed glass substrates, such as Corning's products described above,because these glass substrates have a pristine surface and are highlyuniform.

In certain embodiments, where the flexible glass substrate does not havea pre-applied transparent conductor thereon, the first transparentconductor is applied as part of the fabrication process flow. Forexample, an EC device is fabricated on the thin flexible substrate as inprocess flow 400 described herein, but including fabrication of thefirst transparent conductor thereon. One embodiment is a method offabricating an EC device as described herein, where the substrate is alaminate as described in relation to FIGS. 4K-Q.

After fabrication of the EC device, optionally an edge treatment isperformed, see 487. For example, if no edge treatment was performed inprocess step 484, then one can be performed after the EC fabrication.Also, as part of the EC fabrication, e.g. during laser edge deletion(LED), the edge of the thin annealed glass may be detrimentally affectedand need a further edge treatment after EC fabrication. In otherembodiments, edge treatment prior to EC fabrication includes applicationof an edge adhesive that is cured during the EC fabrication, or after ECfabrication. Aspects 484 and 487 contemplate the latter example. Forexample, an edge adhesive is applied as an edge treatment in 484. Theedge adhesive's curing process is catalyzed by components of a sputterdeposition process to fabricate the EC device, but also require heatingperformed after deposition of the EC device. In another example, an edgeadhesive is applied at 484, e.g. an epoxy or a silicone based adhesive,but the adhesive requires heating performed after deposition of the ECdevice to fully cure. In another example, a first edge adhesive, with orwithout mechanical edge modification, is applied to the thin flexibleannealed glass edge at 484. The heating of the EC fabrication processallows the first edge adhesive to flow more freely and enter anymicrocracks and defects at the glass edge. After the EC devicefabrication, a second edge adhesive is applied, before or after the EClaminate cools to ambient.

Referring again to FIG. 4K, after the second optional edge treatment, atop coat is optionally applied to the EC device to protect it, see 488.A top coat may be added as an encapsulant, e.g., as a hermetic seal toprotect the laminate from the ambient. In certain embodiments, theencapsulant also serves as an edge adhesive as described herein. Forexample, in one embodiment, the encapsulant is a parylene, e.g. paryleneAF-4 (a para-xylylene derivative which is also teflon derivative). Inanother embodiment, the top coat is a silicone or epoxy basedencapsulant such as those commercially available from e.g. Polysciences,Inc. of Warrington, Pa. or those available from Dow Corning Corporation,of Midland Mich. These encapsulants can also be adhesives, therefore incertain embodiments the topcoat procedure also protect the edges of theannealed thin glass, and thus is used in lieu of, or in addition to,edge treatments. In one embodiment, the process flow 482 does notinclude 484 or 487, but rather the topcoat application, 488, is all thatis necessary to protect the edges of the thin annealed glass substrate(as well as the EC device as a whole). In other embodiments, one or moreedge treatments as described herein are combined with the topcoat for amore robust laminate that can withstand both temperature changes as wellas ambient exposure and impact.

Referring again to FIG. 4K, after the optional topcoat, the laminate isoptionally incorporated into an IGU, see 489. Since methods describedherein may produce a strong laminate, incorporation into an IGU isoptional. The laminate may be further strengthened by laminating anothertempered, heat strengthened or polymeric lite to the EC device in orderto protect the flexible annealed lite and/or the EC device from impact.

In one embodiment, the laminate is incorporated into an IGU, where theoptical device, e.g. an EC device, is in the interior volume of the IGU.This may be done before or after excising the laminates from the bulksheet 478 (see FIG. 4Q for the latter). In such embodiments, the ECdevice may or may not have a topcoat and/or extra lite laminated to theEC device side, because the interior volume protects the EC device. Inone embodiment the laminate does include a topcoat and is alsoincorporated into an IGU where the EC device is within the interiorvolume of the IGU. This construction is useful, e.g., if the IGU'sinterior-proximate pane and/or the primary and secondary seals shouldfail, the EC device will be protected from the ambient by the topcoat.The IGU may have only a single laminate as described herein, e.g. adouble pane IGU where the mate lite of the IGU is a single glass lite.In other embodiments, the IGU is a double pane construct with twolaminates as described herein serving as the two panes of the IGU.Triple pane IGU's are also within the scope of the embodiments describedherein, with one, two or three laminates as described herein.

In certain embodiments, a tempered or heat strengthened glass sheet islaminated to a thin annealed glass sheet and then an EC device coatingis fabricated thereon. FIG. 4R depicts a process flow, 482 a, much likeprocess flow 482 as described in FIG. 4K. In this particular processflow, the tempered or heat strengthened glass sheet is laminated to theannealed glass, where the annealed glass is in a roll, 478. Theindividual tempered or heat strengthened glass sheets are laminated tothe annealed glass using high temperature lamination adhesive asdescribed herein, see 483. The laminates are cut from the bulk sheet ofannealed glass, see 421. Optionally edge processing is performed, 422,where the laminates edges are ground, adhesive is applied, and the likeas described herein, e.g. in relation to FIGS. 4M-P. As described inrelation to FIG. 4B, edge deletion may be performed if the annealedglass has a transparent conductive coating already applied, see 405.Next, e.g. an all PVD process is used to deposit an EC coating thereon,see 486. As described in relation to FIG. 4B, another edge deletion maybe performed, see 415. Next bus bars are attached, see 625, after BPE isformed if needed (not depicted). The EC device laminates may beoptionally incorporated in IGUs.

Referring to FIGS. 4L and 4Q, now having an understanding of theembodiments above, it is noted, that the individual laminates need notbe cut free from the bulk sheet until after the optical device isapplied to the bulk sheet, or even until after an IGU construct isfabricated. FIG. 4Q shows an IGU assembly line and associated processflow, 496. That is, in one embodiment, the bulk sheet with the laminatesattached thereto is run through an optical coating fabrication processas described herein, as indicated by the box at the top of FIG. 4Q. Thiswould be consistent with steps 483 and 486 of process flow 482 asdescribed in relation to FIG. 4K, specifically where laminates 481 arenot cut from the bulk sheet until after IGU formation. Referring to FIG.4Q, laminates 481 are formed and complete EC devices are fabricated onthe thin annealed glass, 478, side of each laminate, including anoptional top coating, bus bars and associated wiring. In one embodiment,the bus bars (and optionally the wiring thereto) are fabricated and thetop coat applied thereafter. This avoids having to penetrate the topcoat to apply bus bars. After the bulk thin flexible annealed sheetleaves the lamination EC fabrication portion of the assembly line, eachindividual laminate now has an optical device thereon (e.g. an ECdevice, even more particularly a solid state and inorganic EC device,even more particularly an all PVD solid state and inorganic EC device).IGU spacers, 497, are applied to each laminate, still attached to thebulk sheet, as well as mate lites, 498, in this example the mate litesare tinted to aid in visualization. In one embodiment, the spacers arepre-wired spacers as described in Patent Application, serial numberPCT/US2012/068950, filed Dec. 11, 2012 which is herein incorporated byreference. Such IGU spacers have wiring for bus bars integral to them,and some include contacts on the glass to spacer mating surface which,in certain embodiments, obviate the need for bus bars. The spacer and/ormate lite has an adhesive applied to it, and they are collectivelyregistered with each laminate 481 before it enters an IGU press, wherethe IGU's are formed. The primary seal is thus formed during IGUformation. In one embodiment, the adhesive is a conventional IGU primarysealant such as PVB. In certain embodiments, the adhesive is an epoxyadhesive/sealant. As described above, epoxy based adhesives may impartadded durability to the thin annealed glass edge. In one embodiment,there is no edge treatment as described in relation to process flow 482of FIG. 4K, but rather the epoxy based primary sealant applied duringIGU formation is sufficient to both protect the annealed glass edge, butalso to form a superior primary seal.

The IGU's 499 emerge from the press with their primary seals formed, theEC device hermetically sealed within the IGU, while still attached tothe bulk sheet 478. After the completed IGU's are fabricated they areexcised from the bulk sheet. As mentioned above, the excess bulk sheetcan be recycled thereafter. The IGU's may have secondary sealant appliedbefore or after excision from the bulk sheet, but typically this is doneafter, so as not to interfere with cutting them free of the sheet.Process flow 496 can be done horizontally, or vertically—with theappropriate carriers to support the thin substrate with attachedlaminates and ultimately IGU's.

In accord with, but not limited by, the methods described herein,further embodiments include optical devices, laminates, IGU's andrelated articles.

One embodiment is an optical device laminate including: i) a firstsubstrate including a material selected from the group consisting oftempered glass, heat strengthened glass, chemically strengthened glassand a polymer; ii) a second substrate laminated to the first substrate,where the second substrate is a low-sodium annealed glass; iii) alamination adhesive between the first and second substrates, thelamination adhesive capable of withstanding temperatures of betweenabout 300° C. and 450° C.; and iv) an optical device on the outersurface of the second substrate. In one embodiment, the second substrateis between about 0.5 mm and about 2.0 mm thick, in another embodimentthe second substrate is less than 0.3 mm thick, in another embodimentthe second substrate is less 0.2 mm thick, in yet another embodiment thesecond substrate is less than 0.1 mm thick. In one embodiment, theoptical device is a solid state and inorganic electrochromic device. Inone embodiment, the first substrate is a tempered glass lite. In oneembodiment, the tempered glass lite is between about 2 mm and about 25mm thick.

In certain embodiments, the second substrate is larger than the firstsubstrate such that there is an overhang of the second substrate aboutthe perimeter of the first substrate. In other embodiments, the secondsubstrate is set back from the first substrate about the perimeter ofthe laminate.

The second substrate may include an edge treatment. In one embodiment,the edge treatment includes an edge adhesive. The edge treatment mayinclude an edge grind and/or polish in addition to, or as an alternativeto, the edge adhesive. In one embodiment, the edge adhesive is an epoxyor a silicone based adhesive. The edge adhesive may be of low viscosityso as to penetrate and seal microcracks and defects in the glass edge.An edge treatment may include a melted portion of the second substrateabout the perimeter of the second substrate. An edge treatment may alsoinclude laser treatment remove defect portions of the edge and/or bevelthe edge.

In one embodiment, the optical device laminate includes a top coatapplied to the optical device, e.g. to a solid state and inorganicelectrochromic device is applied a top coat to hermetically seal thedevice or otherwise protect it from the ambient. One embodiment is anIGU including an optical device laminate as described herein.

One embodiment is an optical device construct including: i) an annealedglass sheet; ii) a plurality of tempered glass lites laminated to theannealed glass sheet with a lamination adhesive; and iii) an opticaldevice coated on the annealed glass sheet on the side opposite thelamination adhesive. In one embodiment, the annealed glass sheet is lowsodium annealed glass between about 0.5 mm and about 2.0 mm thick, inanother embodiment the annealed glass sheet is low sodium annealed glassless than 0.3 mm thick, in yet another embodiment the annealed glasssheet is low sodium annealed glass less 0.2 mm thick, and in still yetanother embodiment the annealed glass sheet is low sodium annealed glassless than 0.1 mm thick. In one embodiment, the lamination adhesive is asilicone based lamination adhesive capable of withstanding temperaturesof between about 300° C. and 450° C. The optical device may be a solidstate and inorganic electrochromic device.

In certain embodiments, the optical device construct further includes:iv) a plurality of spacers registered with each of the plurality oftempered glass lites and adhered to the annealed glass sheet; and v) aplurality of mate lites, each registered with one of the plurality ofspacers and adhered thereto, thereby forming a plurality if IGUconstructs sharing the annealed glass sheet. One embodiment is aplurality of IGU constructs that share a common sheet of annealed glass.In one embodiment, the annealed glass is thin flexible low sodiumannealed glass e.g. as described herein.

As described, e.g. in relation to FIG. 4A-E, EC devices may have two busbars, one for each transparent conducting layer. However, methods hereinalso include fabrication of devices having more than one bus bar foreach transparent conducting layer, specifically bus bars on opposingsides of each of the first and second conductor layer. This may beparticularly important when fabricating larger EC devices that wouldotherwise require longer switching times due to the sheet resistance andhaving large-area devices.

FIG. 5A describes aspects of a process flow, 500, for fabricating anoptical device have opposing bus bars on each of the first and secondconductor layers, according to embodiments. For illustration, FIG. 5Bincludes top views depicting the process flow described in relation toFIG. 5A as it relates to fabrication of a rectangular electrochromicdevice. FIG. 5C shows cross-sections of the electrochromic litedescribed in relation to FIG. 5B.

Referring to FIGS. 5A and 5B, process flow 500 begins with removing thefirst width A of the first conducting layer from two opposing sides atthe perimeter of the substrate, see 505. As described above, this mayinclude removal of a diffusion barrier or not. A substrate with a firstconductor layer, 530, is depicted. After step 505, two opposing edgeportions of the substrate (or diffusion barrier) are exposed. Edge taperand polish steps may be performed as described in relation to FIGS. 4Aand 4B. The one or more material layers of the device and the secondconductor layer (and optionally a moisture barrier) are applied to thesubstrate, see 510. A second width B is removed from the entireperimeter of the substrate, see 515. In this example, two BPE's, 435,are fabricated, see 520. Thus in accord with methods described above,the at least one exposed portion of the first conducting layer includesa pair of exposed portions fabricated along the lengths of the opposingsides of the optical device from which the first width was not removedin 505. Bus bars are applied, see 525, to make device 540 (thus, forexample, in accord with methods described above, applying the at leastone second bus bar to the second conducting layer includes applying apair of second bus bars, each of the pair of second bus bars on opposinglengths of the second conducting layer and over areas where the firstconducting layer was removed in 505). FIG. 5B indicates cross-sectionsC-C′ and D-D′ of device 540. Drawings of the cross-sectional views ofdevice 540 at C-C′ and D-D′ are shown in more detail in FIG. 5C.

FIG. 5C shows cross-sections C-C′ and D-D′ of device 540. In thisexample, the diffusion barrier was removed when width A and width B wereremoved. Specifically, perimeter area 140 is free of first conductorlayer and diffusion barrier; although in one embodiment the diffusionbarrier is left intact to the edge of the substrate about the perimeteron one or more sides. In another embodiment, the diffusion barrier isco-extensive with the one or more material layers and the secondconductor layer (thus width A is fabricated at a depth to the diffusionbarrier, and width B is fabricated to a depth sufficient to remove thediffusion barrier). In this example, there is an overlapping portion,545, of the one or more material layers only on opposing sides of thefunctional device. On both of these overlapping portions, on the secondTCO, bus bars 1 are fabricated. In one embodiment, a vapor barrier layeris fabricated co-extensive with the second conductor layer. In thisembodiment, two portions of the vapor barrier are removed in order toexpose the second conductor layer for bus bars 1. These exposed portionsare analogous to areas 435, the BPEs for bus bars 2.

FIG. 5D depicts an electrochromic device, 540 a, analogous torectangular device 540. Bus bars 550 are on the first conductor layerand bus bars 555 are on the second conductor layer. Thus, the BPEs 435are fabricated on opposing sides of the circular area and analogousopposing bus bars are applied to the second conductor layer.

FIG. 5E depicts an electrochromic device, 540 b, in this example atriangular shaped device. In this example, area 140 b is analogous toareas 140 and 140 a in previously described devices. Device 540 b hasone angled bus bar, 570, and one linear bus bar, 580. In this example,angled bus bar 570 is on the region, 565, of the second conductor layerthat is not over the first conductor layer, and linear bus bar 580 is onthe BPE, 435. Triangular optical devices are not limited to thisparticular configuration, e.g., the BPE could be along two orthogonalsides and have the angled bus bar, and the linear bus bar could be onthe second conductor layer. The point is that methods described hereincan be used to fabricate optical devices of virtually any shape. Also,various masking steps may be used to fabricate devices as describedherein, although masking adds extra steps. Other embodiments includeoptical devices.

One embodiment is an optical device including: (i) a first conductorlayer on a substrate, the first conductor layer including an area lessthan that of the substrate, the first conductor layer surrounded by aperimeter area of the substrate which is substantially free of the firstconductor layer; (ii) one or more material layers including at least oneoptically switchable material, the one or more material layersconfigured to be within the perimeter area of the substrate andco-extensive with the first conductor layer but for at least one exposedarea of the first conductor layer, the at least one exposed area of thefirst conductor layer free of the one or more material layers; and (iii)a second conductor layer on the one or more material layers, the secondconductor layer transparent and co-extensive with the one or morematerial layers, where the one or more material layers and the secondconductor layer overhang the first conductor layer but for the at leastone exposed area of the first conductor layer. In one embodiment, theoptical device further includes a vapor barrier layer coextensive withthe second conductor layer. There may be a diffusion barrier between thesubstrate and the first conductor layer. The perimeter area of thesubstrate can include the ion diffusion barrier. In one embodiment, theat least one optically switchable material is an electrochromicmaterial. In one embodiment, the substrate and the first conductor layerare also transparent. In one embodiment, the at least one exposed areaof the first conductor layer includes a strip proximate the perimeterarea of the substrate. The device may include a first bus bar on andwithin the area of the strip. The device may also include a second busbar on the second conductor layer, the second bus bar configured to beon or disposed on a portion of the second conducting layer that does notcover the first conducting layer, the portion proximate the perimeterarea and opposite the first bus bar. In one embodiment, the first andsecond conductor layers and the one or more material layers are allsolid-state and inorganic. In one embodiment, the substrate is floatglass, tempered or untempered, and the first conducting layer includestin oxide, e.g. fluorinated tin oxide. In one embodiment, the substrateis registered with a second substrate in an IGU. In one embodiment, anyotherwise exposed areas of the first conducting layer are configured tobe within the primary seal of the IGU, the bus bars may also beconfigured to be within the primary seal of the IGU as well as the areaof the second conductor layer that is not over the first conductorlayer. The optical device may be rectangular, round, oval, triangularand the like.

In certain embodiments, opposing bus bars on each conductor layer areused. In one embodiment, the at least one exposed area of the firstconductor layer includes a pair of strips, each strip of the pair ofstrips on opposing sides of the first conductor layer proximate theperimeter area of the transparent substrate. Depending upon the shape ofthe device, the strips may be linear or curved, for example. The stripscan include a first pair of bus bars, each of the first pair of bus barson and within the area of each strip of the pair of strips. A secondpair of bus bars on the second conductor layer can be included, each ofthe second pair of bus bars configured to be on or disposed on each oftwo portions of the second conducting layer that do not cover the firstconducting layer, each of the two portions proximate the perimeter areaand on opposing sides of the second conducting layer.

The first and second conductor layers and the one or more materiallayers of optical devices described herein may be all solid-state andinorganic. In one embodiment, the substrate is float glass, tempered oruntempered, and the first conducting layer includes tin oxide, e.g.fluorinated tin oxide. The substrate may be registered in an IGU with anadditional EC device or not. As described, the bus bars, any laserscribes, device edges, and/or exposed portions of the first conductorlayer may be sealed in the primary seal of the IGU. Dual EC device IGU'sare described in U.S. patent application Ser. No. 12/851,514 (now U.S.Pat. No. 8,270,059), filed Aug. 5, 2010, and titled “Multi-paneElectrochromic Windows,” which is hereby incorporated by reference inits entirety. One embodiment is a multi-pane window as described in thatapplication, having one or more EC devices as described herein. Oneembodiment is any optical device described herein which does not includea laser isolation scribe. One embodiment is any optical device describedherein which does not include an inactive portion of the optical device.

As described above in relation to FIGS. 4H and 4I, some embodimentsinclude coat then cut fabrication. FIGS. 5F and 5G depict a process flowsimilar to that described in relation to FIG. 5A and carried out on alarge-area substrate as applied to coat then cut methods of disclosedembodiments. This is an example of fabricating EC devices having twoopposing bus bars on each transparent conducting layer. The laminationembodiments described above also apply to the coat then cut embodimentsdescribed below.

Referring to FIG. 5F, a large area substrate, 530, has a transparentconducting layer thereon (as indicated by the dotted pattern). Duringoperation 505, an edge delete is performed at a first width A. The edgedelete between what will be neighboring EC devices is made to be doubleof A, so that each EC device has an equivalent edge delete width A. Inoperation 510, the remaining EC device layers are applied. Next, see515, the edge delete at width B, narrower than width A, is performed. Inthis example, the isolated EC device precursors are analogous to thosedescribed in FIG. 5B after operation 515.

Referring to FIG. 5G, operation 520 creates bus bar pad expose regions435, in this example, two for each EC device. Operation 525 includesapplication of bus bars, two for each of the transparent conductorlayers. In operation 570, the large area substrate is cut to produce, inthis example, 12 EC devices 540. As described above in relation to FIGS.4H-J, these may be incorporated into IGUs, or laminated directly, forexample, using a thin flexible substrate.

As described above, thin flexible substrates may be used asstrengthening panes (mate lites) for EC lites, e.g. EC lites fabricatedas described herein. In certain embodiments, thin flexible substratesare used as substrates for the EC lite fabrication process. For example,one embodiment includes any of the EC device fabrication methodsdescribed herein performed on a thin flexible substrate as describedherein, e.g. Gorilla® Glass or Willow™ Glass. In some embodiments,fabrication is performed using a roll-to-roll fabrication scheme.Examples of this embodiment are described below in relation to FIGS. 6Aand 6B.

FIG. 6A depicts roll-to-roll fabrication, 600, of electrochromic deviceson thin flexible substrates and optional lamination with rigidsubstrates. FIG. 6A is a fusion of a chart-type process flow with blockdiagrams including functional descriptions of apparatus and devicefeatures. The actual apparatus for performing the described fabricationmay be in any orientation, but in one embodiment, the flexible substrateis preferably vertical. In another embodiment, the substrate is verticaland the process operations are performed in a “top down” format, wherethe substrate is fed into the line from a first height, passes downwardthrough the fabrication process, and ends at a second height, lower thanthe first height. In this example, a thin flexible substrate, 478 a (asdescribed above), includes a transparent conductive oxide layer. Anexample of this substrate is Willow Glass™, which is commerciallyavailable with an ITO coating from Corning, Incorporated of Corning,N.Y. The heavy dotted arrow in FIG. 6A indicates the direction of motionof the flexible substrate through various modules.

First, the flexible substrate is fed into an edge deletion module, 605.In this module, the edge deletion of a first width (as described herein)from the transparent conductor layer is performed. The substrate mayoptionally be cleaned (not depicted in FIG. 6A) of any contaminantsresulting from the first edge delete. Also, in accord with embodimentsdescribed herein, e.g. in relation to FIGS. 4A and 4B, the transparentconducting layer may be given an edge taper and/or polishing process(not depicted). Next, the thin flexible substrate enters a coater, 610,where the remaining layers of the EC device are deposited, in thisexample, using a vacuum integrated all-PVD sputter apparatus. Suchapparatus are described in U.S. Pat. No. 8,243,357, titled, “Fabricationof Low Defectivity Electrochromic Devices,” filed on May 11, 2011, whichis hereby incorporated by reference in its entirety. After the flexiblesubstrate is coated with the EC device, a second edge delete (asdescribed herein) is carried out, in this example, in a module 615. Edgedeletion may optionally be followed by edge taper (not shown). Next isBPE fabrication, 620, followed by application of bus bars, see 625.Optionally, the flexible substrate may be laminated with a mate lite,see 630, e.g. as described in relation to FIG. 4J. The mate lite may beflexible as the substrate, or a rigid substrate, such as annealed glassor a polymeric substrate. In this example, the flexible substrate islaminated with annealed glass. The flexible substrate is then cut,either to match the rigid substrate to which it is laminated (asdepicted) which produces laminated EC devices 640, or as a monolithicflexible EC device (not shown). In the latter embodiment, the flexibleEC device may be coated with a vapor barrier and/or encapsulation layerprior to or after cutting from the bulk material.

Depending upon the width of the flexible substrate, there may be one ormore EC devices fabricated along the width of the flexible substrate asit passes through modules/process flows 605-635. For example, if theflexible substrate is as wide as a large area float glass substrate asdescribed herein, lamination with the large area substrate will producea corresponding large-area laminate. Individual EC lite laminates can becut from that large area laminate, e.g. as described above.

In some embodiments, a flexible EC device laminate is desired. In oneembodiment, the flexible substrate bearing the plurality of EC devicesis itself laminated with another flexible substrate. FIG. 6B depictsfabrication, 650, of electrochromic devices on flexible glass substratesand subsequent lamination with flexible substrates. In this example,flexible substrate 478 a (as described above) having a transparentconductor layer thereon is fed through fabrication line processes605-625 as described in relation to FIG. 6A. Then, the flexiblesubstrate, having a plurality of EC devices thereon, is laminated withanother flexible substrate, in this example substrate 478 as describedabove, via appropriate application of lamination adhesive and rollers630. The newly formed laminate is cut, e.g. via laser, see 635, to formindividual flexible EC laminates. 665, which, e.g., can pass alongconveyer 477 for further processing. As described above, the flexiblesubstrate “mate lite” may be patterned with apertures to accommodate thebus bars, or ablated to reveal TCO and the bus bars (process 625) addedafter lamination, either before or after cutting into individuallaminated EC lites.

Although the foregoing embodiments have been described in some detail tofacilitate understanding, the described embodiments are to be consideredillustrative and not limiting. It will be apparent to one of ordinaryskill in the art that certain changes and modifications can be practicedwithin the scope of the above description and the appended claims.

We claim:
 1. A method of fabricating an optical device, the methodcomprising: a) receiving a first substrate, said first substratecomprising a material selected from the group consisting of temperedglass, heat strengthened glass, chemically strengthened glass and apolymer; b) laminating a second substrate to the first substrate to forma laminate, wherein the second substrate is a thin flexible low-sodiumannealed glass; and c) fabricating the optical device on the outersurface of the thin flexible low-sodium annealed glass of the laminate.2. The method of claim 1, wherein the optical device is a solid stateand inorganic electrochromic device.
 3. The method of claim 2, whereinthe first substrate is a tempered glass lite.
 4. The method of claim 3,wherein the tempered glass lite is between about 2 mm and about 25 mmthick.
 5. The method of claim 4, wherein b) comprises using a siliconebased lamination adhesive capable of withstanding temperatures ofbetween about 300° C. and 450° C.
 6. The method of claim 5, wherein thesecond substrate is larger than the first substrate and b) furthercomprises registering the first and second substrates so they arecentered with each other on both X and Y axes, so that after b) there isan overhang of the second substrate about the perimeter of the firstsubstrate.
 7. The method of claim 6, wherein the first substrate isbetween about 30 cm and about 300 cm on its largest dimension, and thesecond substrate is a ribbon between about ½ m and about 3 m wide andbetween about 10 m and about 300 m long.
 8. The method of claim 7,wherein a plurality of the first substrate are laminated to the secondsubstrate in b).
 9. The method of claim 7, further comprising cuttingthe excess of the second substrate from about the perimeter of thelaminate.
 10. The method of claim 1 or 9, wherein the first and secondsubstrate's lamination surfaces are coextensive.
 11. The method of claim1 or 9, wherein the second substrate is set back from the firstsubstrate about the perimeter of the laminate.
 12. The method of claim7, wherein cutting the excess of the second substrate from the perimeterof the laminate comprises using at least one of laser cutting,electrothermal cutting and mechanical cutting.
 13. The method of claim9, further comprising applying an edge treatment to the perimeter of thesecond substrate of the laminate so as to strengthen or protect theedge.
 14. The method of claim 13, wherein the edge treatment comprisesapplication of an edge adhesive.
 15. The method of claim 13, wherein theedge treatment comprises an edge grind and/or polish.
 16. The method ofclaim 13, wherein the edge treatment comprises both an edge grind andapplication of an edge adhesive.
 17. The method of claim 14 or 16,wherein the edge adhesive is an epoxy or a silicone based adhesive. 18.The method of claim 17, wherein the edge adhesive comprises a lowviscosity so as to penetrate and seal microcracks and defects in theglass edge.
 19. The method of claim 17, wherein application of an edgeadhesive is a two-part application of the low viscosity portion, andapplication of a more viscous portion thereafter.
 20. The method ofclaim 13, wherein the edge treatment comprises heating the edge to meltand outer portion so as to reduce or eliminate microcracks and defectsin the edge.
 21. The method of claim 13, wherein the edge treatmentcomprises application of a laser to remove defect portions of the edgeand/or bevel the edge.
 22. The method of any of claims 1-21, furthercomprising cleaning the laminate between b) and c).
 23. The method ofclaim 2, further comprising applying a top coat to the solid state andinorganic electrochromic device of the laminate after c).
 24. The methodof any of claims 1-23, further comprising fabricating an IGU from thelaminate, wherein the optical device is within the sealed volume of theIGU.
 25. A method of forming a plurality of EC laminates, the methodcomprising: a) laminating a plurality of support substrates to a singlesheet of thin flexible low-sodium annealed glass; said plurality ofsupport substrates comprising one or more of at least one of a temperedglass lite, a heat strengthened glass lite, a chemically strengthenedglass lite and a polymeric lite; b) cutting the plurality of laminatesfrom the single sheet of thin flexible low-sodium annealed glass; and c)coating each of the plurality of laminates with an EC device.
 26. Themethod of claim 25, wherein a) comprises using a silicone basedlamination adhesive capable of withstanding temperatures of betweenabout 300° C. and 450° C.
 27. The method of claim 26, wherein the ECdevice is a solid state and inorganic electrochromic device.
 28. Themethod of claim 27, wherein each of the plurality of support substratesis a tempered glass lite.
 29. The method of any of claims 25-28, whereinthe plurality of laminates are cleaned after b) and before c).
 30. Themethod of claim 29, wherein the plurality of laminates are top coated onthe EC device side after c).
 31. A method of forming a plurality ofIGUs, the method comprising: a) laminating a plurality of supportsubstrates to a single sheet of thin flexible low-sodium annealed glassto make a plurality of laminates; said plurality of support substratescomprising one or more of at least one of a tempered glass lite, a heatstrengthened glass lite, a chemically strengthened glass lite and apolymeric lite; b) coating each of the plurality of laminates with an ECdevice; c) applying bus bars to each EC device; d) applying a spacer toeach EC device; e) applying a mate lite to each spacer; and f) pressingthe constructs to form the plurality of IGUs; wherein the IGUs are cutfrom the single sheet of thin flexible low-sodium annealed glass. 32.The method of claim 31, wherein a) comprises using a silicone basedlamination adhesive capable of withstanding temperatures of betweenabout 300° C. and 450° C.
 33. The method of claim 31, wherein the ECdevice is a solid state and inorganic electrochromic device.
 34. Themethod of claim 31, wherein each of the plurality of support substratesis a tempered glass lite.
 35. The method of any of claims 31-34, whereinthe plurality of laminates are cleaned after a) and before b).
 36. Themethod of claim 31, wherein the plurality of laminates top coated on theEC device side after b).
 37. The method of claim 31, wherein theplurality of laminates top coated on the EC device side after c). 38.The method of any of claims 31-37, wherein c) and d) are donesimultaneously, wherein the spacer is a pre-wired spacer.
 39. The methodof claim 31, wherein the spacer and/or the mate lite has a pre-appliedprimary sealant.
 40. An optical device laminate comprising: i) a firstsubstrate comprising a material selected from the group consisting oftempered glass, heat strengthened glass, chemically strengthened glassand a polymer; ii) a second substrate laminated to the first substrate,wherein the second substrate is a low-sodium annealed glass; iii) alamination adhesive between the first and second substrates, thelamination adhesive capable of withstanding temperatures of betweenabout 300° C. and 450° C.; and iv) an optical device on the outersurface of the second substrate.
 41. The optical device laminate ofclaim 40, wherein the second substrate is between about 0.5 mm and about2.0 mm thick.
 42. The optical device laminate of claim 40, wherein thesecond substrate is less than 0.3 mm thick.
 43. The optical devicelaminate of claim 40, wherein the second substrate is less 0.2 mm thick.44. The optical device laminate of claim 40, wherein the secondsubstrate is less than 0.1 mm thick.
 45. The optical device laminate ofclaim 40, wherein the optical device is a solid state and inorganicelectrochromic device.
 46. The optical device laminate of claim 40,wherein the first substrate is a tempered glass lite.
 47. The opticaldevice laminate of claim 40, wherein the tempered glass lite is betweenabout 2 mm and about 25 mm thick.
 48. The optical device laminate ofclaim 40, wherein the second substrate is larger than the firstsubstrate such that there is an overhang of the second substrate aboutthe perimeter of the first substrate.
 49. The optical device laminate ofclaim 40, wherein the second substrate is set back from the firstsubstrate about the perimeter of the laminate.
 50. The optical devicelaminate of claim 40, wherein the perimeter of the second substratecomprises an edge treatment.
 51. The optical device laminate of claim50, wherein the edge treatment comprises an edge adhesive.
 52. Theoptical device laminate of claim 50, wherein the edge treatmentcomprises an edge grind and/or polish.
 53. The optical device laminateof claim 50, wherein the edge treatment comprises both an edge grind andan edge adhesive.
 54. The optical device laminate of claim 51 or 53,wherein the edge adhesive is an epoxy or a silicone based adhesive. 55.The optical device laminate of claim 54, wherein the edge adhesivecomprises a low viscosity so as to penetrate and seal microcracks anddefects in the glass edge.
 56. The optical device laminate of claim 50,wherein the edge treatment comprises a melted portion of the secondsubstrate about the perimeter of the second substrate.
 57. The opticaldevice laminate of claim 50, wherein the edge treatment comprises lasertreatment remove defect portions of the edge and/or bevel the edge. 58.The optical device laminate of claim 45, further comprising a top coatapplied to the solid state and inorganic electrochromic device.
 59. AnIGU comprising the optical device laminate of any one of claims 40-59.60. An optical device construct comprising: i) an annealed glass sheet;ii) a plurality of tempered glass lites laminated to the annealed glasssheet with a lamination adhesive; and iii) an optical device coated onthe annealed glass sheet on the side opposite the lamination adhesive.61. The optical device construct of claim 60, wherein the annealed glasssheet is low sodium annealed glass between about 0.5 mm and about 2.0 mmthick.
 62. The optical device construct of claim 60, wherein theannealed glass sheet is low sodium annealed glass less than 0.3 mmthick.
 63. The optical device construct of claim 60, wherein theannealed glass sheet is low sodium annealed glass less 0.2 mm thick. 64.The optical device construct of claim 60, wherein the annealed glasssheet is low sodium annealed glass less than 0.1 mm thick.
 65. Theoptical device construct of claim 60, wherein the lamination adhesive isa silicone based lamination adhesive capable of withstandingtemperatures of between about 300° C. and 450° C.
 66. The optical deviceconstruct of any of claims 60-65, wherein the optical device is a solidstate and inorganic electrochromic device.
 67. The optical deviceconstruct of claim 66, further comprising: iv) a plurality of spacersregistered with each of the plurality of tempered glass lites andadhered to the annealed glass sheet; v) a plurality of mate lites, eachregistered with one of the plurality of spacers and adhered thereto,thereby forming a plurality if IGU constructs sharing the annealed glasssheet.
 68. A plurality of IGU constructs that share a common sheet ofannealed glass.
 69. The plurality of IGU constructs of claim 68, whereinthe annealed glass is thin flexible low sodium annealed glass asdescribed herein.